Abstract: Described is a transformer end-of-life thermal transmitting indicator (thermal transmitting indicator) that is configured and well suited for monitoring the health of a transformer and communicating the health of the transformer to an end user by way of a cellular transceiver. The thermal transmitting indicator can be configured to alert nearby people of an impending transformer explosion if the transformer fails. The thermal transmitting indicator is also arranged to transmit any problems or impending danger from the transformer to the end user who can then respond by preemptively dealing with the failing transformer. The thermal transmitting indicator comprises liquid sensors spaced in its housing to sense if water or high humidity has infiltrated the housing.

Abstract: Described is a transformer end-of-life thermal transmitting indicator (thermal transmitting indicator) that is configured and well suited for monitoring the health of a transformer and communicating the health of the transformer to an end user by way of a cellular transceiver. The thermal transmitting indicator can be configured to alert nearby people of an impending transformer explosion if the transformer fails. The thermal transmitting indicator is also arranged to transmit any problems or impending danger from the transformer to the end user who can then respond by preemptively dealing with the failing transformer. The thermal transmitting indicator comprises liquid sensors spaced in its housing to sense if water or high humidity has infiltrated the housing.

Abstract: Described is a transformer end-of-life thermal transmitting indicator (thermal transmitting indicator) that is configured and well suited for monitoring the health of a transformer and communicating the health of the transformer to an end user by way of a cellular transceiver. The thermal transmitting indicator can be configured to alert nearby people of an impending transformer explosion if the transformer fails. The thermal transmitting indicator is also arranged to transmit any problems or impending danger from the transformer to the end user who can then respond by preemptively dealing with the failing transformer.

Abstract: Described is a transformer end-of-life thermal transmitting indicator (thermal transmitting indicator) that is configured and well suited for monitoring the health of a transformer and communicating the health of the transformer to an end user by way of a cellular transceiver. The thermal transmitting indicator can be configured to alert nearby people of an impending transformer explosion if the transformer fails. The thermal transmitting indicator is also arranged to transmit any problems or impending danger from the transformer to the end user who can then respond by preemptively dealing with the failing transformer.

Abstract: The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. Finally, an analytical imaging technique is performed on the integrated circuit from the bottom side of the first substrate.

Abstract: The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an integrated circuit to be analyzed. A second substrate is then selected. An adhesive film is applied to the top surface of the first substrate, the adhesive film having adhesive on both sides and covering the opening on the first substrate. An integrated circuit is then inserted into the opening and attached to the bottom side of the adhesive film. Next, the first substrate and integrated circuit are bonded to the second substrate using the adhesive film. The bottom side of the first substrate and the integrated circuit are then thinned until the substrate wafer of the integrated circuit is completely removed. The bottom side of the first substrate and integrated circuit is then thinned to a user-definable level. A handle wafer is then attached to the bottom side of the first substrate.

Abstract: A system and method for purchasing pre-paid account cards and replenishing pre-paid accounts for goods and services. The system includes a data source containing data descriptive of a prepaid account. The data source is accessible by a transaction system for responding to user service transactions and may be accessible by a fulfillment service provider for providing the goods or services based upon the prepaid account data. The system is accessed through a variety of service end points comprising point of sale (POS) systems.

Abstract: To simulate the output of a laser to a Multiple Integrated Laser Engagement ystem (MILES), an electronic circuit having a PLL subcircuit and a microprocessor is used to detect an acoustic signal having a predetermined frequency and pulse rate. Upon detection of the correct acoustic signal, a prestored universal kill code is provided to an inductive loop magnetically coupled to the antenna coil of a harness to which the MILES is integrated. The thus received inductive signal is recognized by the MILES which in turn outputs an audio alarm to indicate that a kill has occurred.