Abstract: The cleaning device may clean probe elements. The probe elements may be the probe elements of a probe card testing apparatus for testing semiconductor wafers or semiconductor dies on a semiconductor wafer or the probe elements of a handling/testing apparatus for testing the leads of a packaged integrated circuit. During the cleaning of the probe elements, the probe card or the handler/tester is cleaned during the normal operation of the testing machine without removing the probe card from the prober. The cleaning device has a working surface with a particular characteristic (a matte finish or a conductive material) so that a prober is capable of automatically determining the location of the working surface of the cleaning device and therefore operate in an automatic cleaning mode.