Abstract: This invention discloses a novel method for separating a semiconductor wafer into a plurality of integrated circuit (IC) chips. The separation is carried out along scribe lines between the IC chips. The method includes steps of (a) forming a photoresist layer on the semiconductor wafer; (b) performing a photolithography process for removing the photoresist layer above the scribe lines between the IC chips; (c) performing an etch process for removing a dielectric layer above the scribe lines between the IC chips for exposing the scribe lines on the semiconductor wafer; (d) performing a wet chemical etch process to anisotropically etch the semiconductor wafer into a V-shaped groove in the scribe lines; and (e) applying a mechanical force to break the semi-conductor wafer along the V-shaped grooves in the scribe lines thus separating the semiconductor wafer into a plurality of IC chips.