Abstract: Provided is a method for removing organic residue from an electronic device substrate by exposure to a corona discharge.

Abstract: A current probe for measuring electrodeposition plating currents. The current monitoring probe includes a conductive layer located on a front face of the current monitoring probe, an insulating layer behind the conductive layer, and a plurality of current sensing circuits located behind the insulating layer. The insulating layer isolates the current sensing circuits from the conductive layer. A plurality of apertures are formed through the conductive layer and the insulating layer, each aperture exposing one of the plurality of current sensing circuits to metal ions incident to the aperture.