Abstract: An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

Abstract: A semi-conductor module burn-in test apparatus having a plurality burn-in boards each of which is provided a plurality of module test sockets thereon and each test socket is coupled to an adjacent test socket by with a high current, open/short split power connector that can readily connected to or disconnected from said adjacent test socket by coupling together the power inputs of the adjacent sockets or uncoupling the previously coupled power inputs of adjacent sockets and thereby selectively altering the current carrying levels available to said adjacent test sockets.