Patents by Inventor Gene Stout

Gene Stout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110003470
    Abstract: In wafer-level chip-scale packaging and flip-chip packaging and assemblies, a solder cap is formed on a vertical pillar. In one embodiment, the vertical pillar overlies a semiconductor substrate. A solder paste, which may be doped with at least one trace element, is applied on a top surface of the pillar structure. A reflow process is performed after applying the solder paste to provide the solder cap.
    Type: Application
    Filed: June 30, 2010
    Publication date: January 6, 2011
    Applicant: FlipChip International, LLC
    Inventors: Guy F. Burgess, Anthony Curtis, Michael E. Johnson, Gene Stout, Theodore G. Tessier
  • Patent number: D327864
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: July 14, 1992
    Assignee: Coachmen Industries, Inc.
    Inventors: Harvey R. Siegel, Rees Noren, Gene Stout