Abstract: A circuit board for automatically interconnecting electrical components mounted on the circuit board, comprising of a nonconducting emulsion layer sandwiched between two nonconducting outer layers. Electrical leads from electronic components are inserted through holes in one outer layer. Dispersed within the emulsion layer are conducting particles with an elongated length. The emulsion layer's melting temperature is lower than the outer layers allowing movement of the conducting particles when the temperature of the emulsion layer is above the melting temperature, and prevents movement when the temperature is below. Included with the circuit board is an electromagnetic and infrared (EIR) assembly positioned near the outer layer opposite the layer with the electronic components. The EIR assembly has an infrared source and two magnetic field generating devices. One produces a magnetic field parallel to the emulsion layer forcing the conducting particles to line up parallel to the emulsion layer.

Abstract: A leadless current-sensing device for sensing current flowing in a conductor when the device is positioned in the vicinity of the current-carrying conductor. The device has a probe having a set of two current sensors disposed at a preset radial angle alpha ".alpha." in respect to each other. The probe also has a second set of two current sensors also disposed at the same preset radial angle in respect to each other. The first and second sets of current sensors are disposed at a preset radial angle delta ".delta." in respect to each other. The first and second sets of current sensors are also disposed at a preset axial distance "z" in respect to each other. The device includes a voltage processing circuit for processing the four distinct voltage potentials induced in the four current sensors. The processing circuit compares to each other two voltage potentials from either set of current sensors to calculate the orientation angle that each current sensor makes with the conductor.