Abstract: Examples described herein relate to a switch, when operational, that is configured to receive in a packet an indicator of number of remaining bytes in a flow and to selectively send a congestion message based on a fullness level of a buffer and indication of remainder of the flow. In some examples, the indicator is received in an Internet Protocol version 4 consistent Options header field or Internet Protocol version 6 consistent Flow label field. In some examples, the congestion message comprises one or more of: an Explicit Congestion Control Notification (ECN), priority-based flow control (PFC), and/or in-band telemetry (INT). In some examples, to selectively send a congestion message to a transmitter based on a fullness level of a buffer that stored the packet and the number of remaining bytes in flow, the switch is to determine whether the buffer is large enough to store the remaining bytes in the flow.

Abstract: Examples described herein relate to a switch, when operational, that is configured to receive in a packet an indicator of number of remaining bytes in a flow and to selectively send a congestion message based on a fullness level of a buffer and indication of remainder of the flow. In some examples, the indicator is received in an Internet Protocol version 4 consistent Options header field or Internet Protocol version 6 consistent Flow label field. In some examples, the congestion message comprises one or more of: an Explicit Congestion Control Notification (ECN), priority-based flow control (PFC), and/or in-band telemetry (INT). In some examples, to selectively send a congestion message to a transmitter based on a fullness level of a buffer that stored the packet and the number of remaining bytes in flow, the switch is to determine whether the buffer is large enough to store the remaining bytes in the flow.

Abstract: Examples described herein relate to a switch, when operational, that is configured to receive in a packet an indicator of number of remaining bytes in a flow and to selectively send a congestion message based on a fullness level of a buffer and indication of remainder of the flow. In some examples, the indicator is received in an Internet Protocol version 4 consistent Options header field or Internet Protocol version 6 consistent Flow label field. In some examples, the congestion message comprises one or more of: an Explicit Congestion Control Notification (ECN), priority-based flow control (PFC), and/or in-band telemetry (INT). In some examples, to selectively send a congestion message to a transmitter based on a fullness level of a buffer that stored the packet and the number of remaining bytes in flow, the switch is to determine whether the buffer is large enough to store the remaining bytes in the flow.

Abstract: Technologies for increasing the bandwidth of partitioned hierarchical networks is disclosed. If each partition of network groups of a computer network are isolated, then the connections between the network groups of different partitions may go unused. However, careful selection of the network connections between partitions of different network groups may allow for a pseudo-direct connection between two network groups of the same partition using a single non-blocking switch in a network group of a different partition. Such a configuration can increase the effective bandwidth available within a partition without affecting the bandwidth available in another partition.

Abstract: Technologies for increasing the bandwidth of partitioned hierarchical networks is disclosed. If each partition of network groups of a computer network are isolated, then the connections between the network groups of different partitions may go unused. However, careful selection of the network connections between partitions of different network groups may allow for a pseudo-direct connection between two network groups of the same partition using a single non-blocking switch in a network group of a different partition. Such a configuration can increase the effective bandwidth available within a partition without affecting the bandwidth available in another partition.

Abstract: An improved Wafer-Level Chip-Scale Packaging (WLCSP) process is described that includes forming a plurality of conductive pillars on a first surface of a semiconductor wafer. One or more grooves are dry etched into the first surface of the semiconductor wafer, where the grooves define at least one boundary between each of a plurality of die within the semiconductor wafer. A layer of encapsulating material is deposited over the first surface. A recess is then cut in each of the grooves through the encapsulating material, where the cutting leaves a piece of semiconductor material on the second surface of the semiconductor wafer. The second surface is then ground to remove the piece of semiconductor material, where the removal of this material separates the plurality of die.

Abstract: A semiconductor packaging structure is provided. The structure includes a base layer comprising alloy 42; die attached on a first side of the base layer; and an interconnect structure on the die, wherein the interconnect structure comprises vias and conductive lines connected to the die.

Abstract: A method of forming a packaging structure and the packages formed thereof are provided. The method includes providing a package having a top surface and placing solder balls on the top surface of the package. A coplanar surface is then placed against the solder balls, wherein the surface is non-adhesive. A reflow process is performed to the solder balls, so that top surfaces of the solder balls are substantially coplanar. The coplanar surface is then removed.

Abstract: An improved Wafer-Level Chip-Scale Packaging (WLCSP) process is described that includes forming a plurality of conductive pillars on a first surface of a semiconductor wafer. One or more grooves are dry etched into the first surface of the semiconductor wafer, where the grooves define at least one boundary between each of a plurality of die within the semiconductor wafer. A layer of encapsulating material is deposited over the first surface. A recess is then cut in each of the grooves through the encapsulating material, where the cutting leaves a piece of semiconductor material on the second surface of the semiconductor wafer. The second surface is then ground to remove the piece of semiconductor material, where the removal of this material separates the plurality of die.

Abstract: A method of forming a packaging structure and the packages formed thereof are provided. The method includes providing a package having a top surface and placing solder balls on the top surface of the package. A coplanar surface is then placed against the solder balls, wherein the surface is non-adhesive. A reflow process is performed to the solder balls, so that top surfaces of the solder balls are substantially coplanar. The coplanar surface is then removed.

Abstract: A reverse build-up method for forming a package substrate includes forming bumps; forming an interconnect structure connected to the bumps; and forming ball grid array (BGA) balls on the interconnect structure. The BGA balls are electrically connected to the bumps through the interconnect structure. The step of forming the bumps are performed before the steps of forming the interconnect structure and forming the BGA balls.

Abstract: A semiconductor packaging structure is provided. The structure includes a base layer comprising alloy 42; die attached on a first side of the base layer; and an interconnect structure on the die, wherein the interconnect structure comprises vias and conductive lines connected to the die.