Abstract: A method of making an integrated circuit includes forming a gate electrode over an active area. The method further includes forming a source region and a drain region on opposite sides of the gate electrode with a channel region under the gate electrode. The method further includes removing a portion of the gate electrode and an underlying portion of the channel to form a first trench that separates a first portion of the active area and a second portion of the active area. The method further includes depositing a dielectric material into the first trench and form a first trench isolation structure between the first portion of the active area and the second portion of the active area. The method further includes forming a plurality of contacts comprising a gate electrode contact, a source region contact, and a drain region contact.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: An integrated circuit read only memory (ROM) structure includes a first ROM transistor with a first gate electrode, a first source, and a first drain, and a second ROM transistor with a second gate electrode, a second source, and a second drain. A drain conductive line is over the first drain and the second drain, and is between the first drain and the second drain. The first drain, the drain conductive line and the second drain are between the first gate electrode and the second gate electrode, and a first trench isolation structure electrically isolates the first drain from the first source is below the first gate electrode.

Abstract: A method of making a ROM structure includes the operations of forming an active area having a channel, a source region, and a drain region; depositing a gate electrode over the channel; depositing a conductive line over at least one of the source region and the drain region; adding dopants to the source region and the drain region of the active area; forming contacts to the gate electrode, the source region, and the drain; depositing a power rail, a bit line, and at least one word line of the integrated circuit against the contacts; and dividing the active area with a trench isolation structure to electrically isolate the gate electrode from the source region and the drain region.

Abstract: An integrated circuit read only memory (ROM) structure includes a first ROM transistor with a first gate electrode, a first source, and a first drain, and a second ROM transistor with a second gate electrode, a second source, and a second drain. A drain conductive line is over the first drain and the second drain, and is between the first drain and the second drain. The first drain, the drain conductive line and the second drain are between the first gate electrode and the second gate electrode, and a first trench isolation structure electrically isolates the first drain from the first source is below the first gate electrode.

Abstract: A memory array includes a first column of memory cells, a second column of memory cells, a first pre-charge circuit, a second pre-charge circuit and a set of input output circuits. The first column of memory cells includes a first bit line, a first word line and a first bit line bar. The second column of memory cells includes the first bit line bar, a second word line and a second bit line. The first pre-charge circuit is coupled to the first bit line. The second pre-charge circuit is coupled to the first bit line bar. The first column of memory cells and the second column of memory cells are configured to share the first bit line bar. The first bit line and the first bit line bar are in a first plane. At least a portion of the first word line and at least a portion of the second word line are in a second plane intersecting the first plane.

Abstract: A memory array includes a first column of memory cells, a second column of memory cells, a first pre-charge circuit, a second pre-charge circuit and a set of input output circuits. The first column of memory cells includes a first bit line, a first word line and a first bit line bar. The second column of memory cells includes the first bit line bar, a second word line and a second bit line. The first pre-charge circuit is coupled to the first bit line. The second pre-charge circuit is coupled to the first bit line bar. The first column of memory cells and the second column of memory cells are configured to share the first bit line bar. The first bit line and the first bit line bar are in a first plane. At least a portion of the first word line and at least a portion of the second word line are in a second plane intersecting the first plane.

Abstract: A memory array includes a first column of memory cells, a second column of memory cells and a set of switching elements. The first column of memory cells includes a first bit line, a first word line and a second bit line. The second column of memory cells includes the second bit line, a second word line and a third bit line. The first and second column of memory cells are configured to share the second bit line. The first and second bit lines are in a first plane. At least a portion of the first word line and at least a portion of the second word line are in a second plane intersecting the first plane. An amount of bit line switching elements in the set of bit line switching elements is equal to N*2, where N is an amount of columns of memory cells in the memory array.

Abstract: A circuit includes: a first data line; a second data line; a write driver including first and second transistors; a first switch connected in series with the first transistor to form a first series-connected pair; a second switch in series with the second transistor to form a second series-connected pair; and a level shifter which includes the first and second transistors. The first series-connected pair is coupled between a first voltage node and the first data line. The second series-connected pair is coupled between the first voltage node and the second data line. Gate terminals of the first and second transistors are correspondingly cross-coupled with the second and first data lines.

Abstract: A semiconductor memory includes a first layer including at least a first memory cell, a second layer including at least a second memory cell, and a wordline shared by the first memory cell and the second memory cell. The first and second memory cells can be above or below the wordline and be coupled to different bit lines.

Abstract: A memory array includes a first column of memory cells, a second column of memory cells and a set of switching elements. The first column of memory cells includes a first bit line, a first word line and a second bit line. The second column of memory cells includes the second bit line, a second word line and a third bit line. The first and second column of memory cells are configured to share the second bit line. The first and second bit lines are in a first plane. At least a portion of the first word line and at least a portion of the second word line are in a second plane intersecting the first plane. An amount of bit line switching elements in the set of bit line switching elements is equal to N*2, where N is an amount of columns of memory cells in the memory array.

Abstract: A memory array includes a first memory column having a first bit line, a first word line and a second bit line. The memory array also includes a second memory column having the second bit line, a second word line and a third bit line. The first memory column and the second memory column are configured to share the second bit line. The sharing of the second bit line facilitates sharing one or more memory array components between the first memory column and the second memory column.

Abstract: A circuit includes: a first data line; a second data line; a write driver including first and second transistors; a first switch connected in series with the first transistor to form a first series-connected pair; a second switch in series with the second transistor to form a second series-connected pair; and a level shifter which includes the first and second transistors. The first series-connected pair is coupled between a first voltage node and the first data line. The second series-connected pair is coupled between the first voltage node and the second data line. Gate terminals of the first and second transistors are correspondingly cross-coupled with the second and first data lines.

Abstract: A circuit includes a first data line, a second data line, a first pulling device, a second pulling device, a third pulling device, and a fourth pulling device. The first pulling device is configured to be activated or deactivated responsive to a first control signal; and is configured to pull a first signal at the first data line toward a voltage level of a first voltage based on a second signal at the second data line when the first pulling device is activated. The second pulling device is configured to be activated or deactivated responsive to a second control signal; and is configured to pull the second signal at the second data line toward the voltage level of the first voltage based on the first signal at the first data line when the second pulling device is activated.

Abstract: A circuit includes a first data line, a second data line, a first pulling device, a second pulling device, a third pulling device, and a fourth pulling device. The first pulling device is configured to be activated or deactivated responsive to a first control signal; and is configured to pull a first signal at the first data line toward a voltage level of a first voltage based on a second signal at the second data line when the first pulling device is activated. The second pulling device is configured to be activated or deactivated responsive to a second control signal; and is configured to pull the second signal at the second data line toward the voltage level of the first voltage based on the first signal at the first data line when the second pulling device is activated.

Abstract: A semiconductor memory includes a first layer including at least a first memory cell, a second layer including at least a second memory cell, and a wordline shared by the first memory cell and the second memory cell. The first and second memory cells can be above or below the wordline and be coupled to different bit lines.

Abstract: A three dimensional (3D) circuit includes a first layer including at least a first memory cell, a second layer including at least a second memory cell, and a wordline shared by the first memory cell and the second memory cell. The first and second memory cells can be adjacent memory cells or bit cells coupled to different bit lines.

Abstract: A three dimensional (3D) circuit includes a first layer including at least a first memory cell, a second layer including at least a second memory cell, and a wordline shared by the first memory cell and the second memory cell. The first and second memory cells can be adjacent memory cells or bit cells coupled to different bit lines.