Patents by Inventor Geng-He Lin
Geng-He Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230369309Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: July 24, 2023Publication date: November 16, 2023Inventors: Tseng Chin LO, Molly CHANG, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Patent number: 11776948Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: GrantFiled: April 18, 2022Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
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Publication number: 20220246600Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: April 18, 2022Publication date: August 4, 2022Inventors: Tseng Chin LO, Molly CHANG, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Patent number: 11403564Abstract: A hotspot detection system that classifies a set of hotspot training data into a plurality of hotspot clusters according to their topologies, where the hotspot clusters are associated with different hotspot topologies, and classifies a set of non-hotspot training data into a plurality of non-hotspot clusters according to their topologies, where the non-hotspot clusters are associated with different topologies. The system extracts topological and non-topological critical features from the hotspot clusters and centroids of the non-hotspot clusters. The system also creates a plurality of kernels configured to identify hotspots, where each kernel is constructed using the extracted critical features of the non-hotspot clusters and the extracted critical features from one of the hotspot clusters, and each kernel is configured to identify hotspot topologies different from hotspot topologies that the other kernels are configured to identify.Type: GrantFiled: June 5, 2019Date of Patent: August 2, 2022Assignee: Synopsys, Inc.Inventors: Charles C. Chiang, Yen-Ting Yu, Geng-He Lin, Hui-Ru Jiang
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Patent number: 11309307Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: GrantFiled: June 8, 2020Date of Patent: April 19, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
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Publication number: 20200303366Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Inventors: Tseng Chin LO, Molly CHANG, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Patent number: 10679980Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: GrantFiled: August 14, 2019Date of Patent: June 9, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
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Publication number: 20190371783Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: August 14, 2019Publication date: December 5, 2019Inventors: Tseng Chin LO, Molly CHANG, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Publication number: 20190287021Abstract: A hotspot detection system that classifies a set of hotspot training data into a plurality of hotspot clusters according to their topologies, where the hotspot clusters are associated with different hotspot topologies, and classifies a set of non-hotspot training data into a plurality of non-hotspot clusters according to their topologies, where the non-hotspot clusters are associated with different topologies. The system extracts topological and non-topological critical features from the hotspot clusters and centroids of the non-hotspot clusters. The system also creates a plurality of kernels configured to identify hotspots, where each kernel is constructed using the extracted critical features of the non-hotspot clusters and the extracted critical features from one of the hotspot clusters, and each kernel is configured to identify hotspot topologies different from hotspot topologies that the other kernels are configured to identify.Type: ApplicationFiled: June 5, 2019Publication date: September 19, 2019Inventors: Charles C. Chiang, Yen-Ting Yu, Geng-He Lin, Hui-Ru Jiang
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Patent number: 10388645Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: GrantFiled: July 27, 2018Date of Patent: August 20, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
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Patent number: 10283496Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: GrantFiled: April 11, 2017Date of Patent: May 7, 2019Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tseng Chin Lo, Molly Chang, Ya-Wen Tseng, Chih-Ting Sun, Zi-Kuan Li, Bo-Sen Chang, Geng-He Lin
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Publication number: 20180358348Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: July 27, 2018Publication date: December 13, 2018Inventors: Tseng Chin LO, Molly CHANG, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Publication number: 20180006010Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.Type: ApplicationFiled: April 11, 2017Publication date: January 4, 2018Inventors: Tseng Chin LO, Molly Chang, Ya-Wen TSENG, Chih-Ting SUN, Zi-Kuan LI, Bo-Sen CHANG, Geng-He LIN
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Publication number: 20140358830Abstract: A hotspot detection system that classifies a set of hotspot training data into a plurality of hotspot clusters according to their topologies, where the hotspot clusters are associated with different hotspot topologies, and classifies a set of non-hotspot training data into a plurality of non-hotspot clusters according to their topologies, where the non-hotspot clusters are associated with different topologies. The system extracts topological and non-topological critical features from the hotspot clusters and centroids of the non-hotspot clusters. The system also creates a plurality of kernels configured to identify hotspots, where each kernel is constructed using the extracted critical features of the non-hotspot clusters and the extracted critical features from one of the hotspot clusters, and each kernel is configured to identify hotspot topologies different from hotspot topologies that the other kernels are configured to identify.Type: ApplicationFiled: May 27, 2014Publication date: December 4, 2014Applicant: Synopsys, Inc.Inventors: Charles C. Chiang, Yen-Ting Yu, Geng-He Lin, Hui-Ru Jiang