Abstract: A glass panel is provided, including a glass panel substrate and a composite film layer disposed on a surface of the glass panel substrate. The composite film layer includes a first base layer, a first barrier layer, a diamond-like carbon film layer, a second barrier layer, a second base layer, and an anti-fingerprint layer that are sequentially stacked. The glass panel is coated with the composite film layer having a specific structure on the surface of the glass panel substrate, so that the glass panel can have high Mohs hardness, to improve a scratch resistance capability of the glass panel. In addition, the composite film layer has strong adhesion to the surface of the substrate and is not easily detached. The composite film layer can further reduce a color difference before and after coating to a specific extent, and increase transmittance.

Abstract: A one-component thermosetting epoxy resin adhesive, including heat-expandable microspheres with an expansion-initiation temperature (Ts) between 90° C.-115° C. and a mean particle size D (0.5) between 30-75 ?m, at least at least one toughness improver and a viscosity of 500 to 5000 Pas at 25° C. The room temperature pumpable expandable adhesives have good adhesion on metal substrates, sufficient expansion rates and a closed surface of the cured foamed material.

Abstract: A chemically strengthened glass ceramic includes strengthening layers respectively formed on opposite sides, and each of the strengthening layers includes a potassium strengthening layer and a sodium strengthening layer sequentially located from a surface to an inside of the chemically strengthened glass ceramic. A depth of the potassium strengthening layer is 0.01 micrometers (?m) to 5 ?m. A depth of the sodium strengthening layer is greater than or equal to 0.1t, where t is a thickness of the chemically strengthened glass ceramic. An average transmittance of a three-dimensional (3D) chemically strengthened glass ceramic in an optical wavelength range of 400 nanometers (nm) to 700 nm is greater than or equal to 85 percent %; a b value of a Lab color chromaticity indicator is greater than or equal to ?2.0; and a haze is less than or equal to 0.25%.

Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) wherein substituents R? and R? independently of one another are H or CH3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula where R2= or CH2, R1=H or methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.

Abstract: A thermally expandable composition, including at least one epoxy-functional polymer, at least one thermoplastic polymer, at least one chemical blowing agent, and at least one activator, wherein the epoxy-functional polymer is present in the composition before expansion with an amount of between 30 and 75 wt.-%, based on the total composition, and the epoxy-functional polymer includes at least 300 mmol epoxy groups per kg polymer, and wherein the chemical blowing agent is able to form at least one reaction product with at least two amino groups upon thermal decomposition, and the chemical blowing agent is in the composition before expansion with an amount of between 5 and 30 wt.-%, based on the total composition.

Abstract: A one-component thermosetting epoxy resin adhesive, including a) at least one epoxy resin A of formula (II) wherein substituents R? and R? independently of one another are H or CH3 and index s has value of 0-12, fraction of epoxy resin A being from 20-70 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive; and b) at least one epoxy novolac EN of formula where R2= methyl and z=0-7, fraction of epoxy novolac EN being from 1-8 wt.-% based on total weight of one-component thermosetting epoxy resin adhesive; and c) at least one latent hardener B for epoxy resins; and d) at least one accelerator C for epoxy resins; and e) at least at least one toughness improver D, fraction of toughness improver D being from 5-40 wt.-%, based on total weight of one-component thermosetting epoxy resin adhesive.

Abstract: A thermally expandable composition, including at least one polymer, cross-linkable by peroxide, at least one peroxide, preferably at least one antioxidant, at least one chemical blowing agent, and at least one activator, wherein the activator includes at least one compound selected from formula (I), wherein radicals R1 and R4 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms; R2 and R3 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms, nitrogen atoms, and/or aromatic moieties or R2 and R3 together form a divalent alkyl radical with 1 to 10 carbon atoms which optionally includes oxygen atoms, nitrogen atoms or aromatic moieties. The composition shows excellent properties in terms of expansion stability over a wide temperature range, can be expanded at temperatures below 150° C. and is suitable for baffle and/or reinforcement elements.

Abstract: Pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder. The pumpable filler materials provide the advantage that they can be applied as needed using conventional injection equipment and can be expanded to provide foam with good physical strength, high expansion and excellent adhesion on oiled metal substrates. Methods for filling closed spaces with the pumpable thermally foaming filler composition as well as vehicle parts are obtainable with the indicated methods.

Abstract: A thermally expandable composition, including at least one epoxy-functional polymer, at least one thermoplastic polymer, at least one chemical blowing agent, and at least one activator, wherein the epoxy-functional polymer is present in the composition before expansion with an amount of between 30 and 75 wt.-%, based on the total composition, and the epoxy-functional polymer includes at least 300 mmol epoxy groups per kg polymer, and wherein the chemical blowing agent is able to form at least one reaction product with at least two amino groups upon thermal decomposition, and the chemical blowing agent is in the composition before expansion with an amount of between 5 and 30 wt.-%, based on the total composition.

Abstract: Described herein is a polyether polyamide block copolymer as well compositions and products containing the polyether polyamide block copolymer. Methods of making and using the copolymer, the compositions, and products are also described herein.

Abstract: The present disclosure relates to a fabrication method of coated glass with a window area. The method includes: coating a base layer with a cerium oxide CeO2 film layer or a lanthanum oxide La2O3 film layer by using a vapor deposition method, wherein the base layer comprises to-be-coated glass, or to-be-coated glass and another layer coated on the to-be-coated glass; coating an ink layer onto the CeO2 film layer or the La2O3 film layer, wherein the ink layer is coated in a non-window area; and soaking the coated glass that has been coated with the ink layer in a weak acid solution, so as to deplate the CeO2 film layer or the La2O3 film layer in a window area.

Abstract: A thermally expandable composition, including at least one polymer, cross-linkable by peroxide, at least one peroxide, preferably at least one antioxidant, at least one chemical blowing agent, and at least one activator, wherein the activator includes at least one compound selected from formula (I), wherein radicals R1 and R4 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms; R2 and R3 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms, nitrogen atoms, and/or aromatic moieties or R2 and R3 together form a divalent alkyl radical with 1 to 10 carbon atoms which optionally includes oxygen atoms, nitrogen atoms or aromatic moieties. The composition shows excellent properties in terms of expansion stability over a wide temperature range, can be expanded at temperatures below 150° C. and is suitable for baffle and/or reinforcement elements.

Abstract: An input/output (I/O) device includes a management controller interface, a plurality of network switching interfaces, a storage interface, a component controller interface, and a plurality of multifunction modules. The multifunction modules further include a processing node interface, a first endpoint coupled to the management controller interface, a second endpoint coupled to one of the plurality of network switching interfaces, a third endpoint coupled to a remote direct memory access (RDMA) block, a fourth endpoint coupled to the storage interface, and a fifth endpoint coupled to the component controller interface.

Abstract: Pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder. The pumpable filler materials provide the advantage that they can be applied as needed using conventional injection equipment and can be expanded to provide foam with good physical strength, high expansion and excellent adhesion on oiled metal substrates. Methods for filling closed spaces with the pumpable thermally foaming filler composition as well as vehicle parts are obtainable with the indicated methods.

Abstract: A processing node of a server rack includes a processor to generate processing node management requests and to process responses to the node management requests, and a communication module to receive the processing node management requests, to transmit over a communication link to a management controller of the server rack external to the processing node a processing node management request, to receive over the communication link from the management controller processing node management information, and to transmit the processing node management information to the processor.

Abstract: A system includes first and second processing nodes and a network switch coupled to the first and second processing nodes via respective first and second interfaces. The network switch includes a management controller coupled to the interfaces to provide management functions to the processing nodes, first and second network interfaces coupled respectively to the first and second interfaces to provide network access for the processing nodes, a message passing interface between the first processing node and the second processing node, a storage interface coupled to the first and second interfaces to provide a storage capacity to the processing nodes, and a remote component controller coupled to the interfaces.

Abstract: A network switching device includes a macroflow sub-plane that performs packet-based routing, a microflow routing module that performs flow-based routing, and a software defined network (SDN) agent. The microflow routing module includes a packet processing module and a virtual port, and is operable to determine that the packet processing module is to be utilized to process a flow, direct the flow to the packet processing module via the virtual port in response to determine that the packet processing module is to be utilized to process the flow, process the flow using the packet processing module, and direct the flow to a destination associated with the flow. The SDN agent sends a port status message to a SDN controller indicating that the microflow routing module includes the virtual port and that the virtual port is associated with the packet processing module.

Abstract: A protocol processing system includes a plurality of communication interfaces. A control head-end is operable to receive a protocol processing engine identifier over a network through one of the communication interfaces from an external system. A plurality of optimized protocol processing engines are coupled to the control head-end, and the control head-end is operable to select a first optimized protocol processing engine from the plurality of optimized protocol processing engines that is identified by the protocol processing engine identifier. In response to being selected, the first optimized protocol processing engine handles communications between an application processing system and the external system.

Abstract: A network interface controller includes a plurality of host interfaces configured to communicate with a plurality of processing nodes, a plurality of network interfaces configured to provide network communication for the processing nodes to a network, and a shared resource configured to provide link based services and stateless offload services for the processing nodes when communicating with the network.

Abstract: A protocol processing system includes a plurality of communication interfaces. A control head-end is operable to receive a protocol processing engine identifier over a network through one of the communication interfaces from an external system. A plurality of optimized protocol processing engines are coupled to the control head-end, and the control head-end is operable to select a first optimized protocol processing engine from the plurality of optimized protocol processing engines that is identified by the protocol processing engine identifier. In response to being selected, the first optimized protocol processing engine handles communications between an application processing system and the external system.