Patents by Inventor Geng-Ming CHANG

Geng-Ming CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING PORTION
    Publication number: 20210335750
    Abstract: A chip package structure is provided. The chip package structure includes a first redistribution layer having a bonding portion. The bonding portion includes a dielectric layer. The chip package structure includes a chip structure bonded to the bonding portion. A first width of the dielectric layer of the bonding portion is substantially equal to a second width of the chip structure. The chip package structure includes a protective layer over the first redistribution layer and surrounding the chip structure. A portion of the protective layer extends into the first redistribution layer and surrounds the bonding portion.
    Type: Application
    Filed: July 2, 2021
    Publication date: October 28, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hang TUNG, Tung-Liang SHAO, Su-Chun YANG, Geng-Ming CHANG, Chen-Hua YU
  • Chip package structure and method for forming the same
    Patent number: 11056459
    Abstract: A method for forming a chip package structure is provided. The method includes partially removing a first redistribution layer to form an alignment trench in the first redistribution layer. The alignment trench surrounds a bonding portion of the first redistribution layer. The method includes forming a liquid layer over the bonding portion. The method includes disposing a chip structure over the liquid layer, wherein a first width of the bonding portion is substantially equal to a second width of the chip structure. The method includes evaporating the liquid layer. The chip structure is in direct contact with the bonding portion after the liquid layer is evaporated.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: July 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hang Tung, Tung-Liang Shao, Su-Chun Yang, Geng-Ming Chang, Chen-Hua Yu
  • CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20200058614
    Abstract: A method for forming a chip package structure is provided. The method includes partially removing a first redistribution layer to form an alignment trench in the first redistribution layer. The alignment trench surrounds a bonding portion of the first redistribution layer. The method includes forming a liquid layer over the bonding portion. The method includes disposing a chip structure over the liquid layer, wherein a first width of the bonding portion is substantially equal to a second width of the chip structure. The method includes evaporating the liquid layer. The chip structure is in direct contact with the bonding portion after the liquid layer is evaporated.
    Type: Application
    Filed: April 3, 2019
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hang TUNG, Tung-Liang SHAO, Su-Chun YANG, Geng-Ming CHANG, Chen-Hua YU