Patents by Inventor Genichi Watanabe

Genichi Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8254083
    Abstract: There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: August 28, 2012
    Assignee: TDK Corporation
    Inventors: Takashi Sakurai, Shinya Yoshihara, Ko Onodera, Hisayuki Abe, Masahiko Konno, Satoshi Kurimoto, Hiroshi Shindo, Akihiro Horita, Genichi Watanabe, Yoshikazu Ito
  • Publication number: 20110051314
    Abstract: There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrode 3 is provided with a ground electrode layer 21 of Cu having been formed by firing, a solder layer 22 formed of a lead-free solder based on five elements of Sn—Ag—Cu—Ni—Ge, and a diffusion layer 23 having been formed by the diffusion of Ni between the ground electrode layer 21 and the solder layer 22. Because the diffusion layer 23 of Ni is formed between the ground electrode layer 21 and the solder layer 22, the diffusion layer 23, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer 21. The diffusion layer 23 of Ni can also suppress the growth of fragile intermetallic compounds of Sn—Cu. Therefore, a decrease in the bonding strength between the ground electrode layer 21 and the solder layer 22 can be prevented.
    Type: Application
    Filed: August 5, 2010
    Publication date: March 3, 2011
    Applicant: TDK CORPORATION
    Inventors: Takashi SAKURAI, Shinya Yoshihara, Ko Onodera, Hisayuki Abe, Masahiko Konno, Satoshi Kurimoto, Hiroshi Shindo, Akihiro Horita, Genichi Watanabe, Yoshikazu Ito
  • Patent number: 7611982
    Abstract: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
    Type: Grant
    Filed: April 14, 2004
    Date of Patent: November 3, 2009
    Assignee: TDK Corporation
    Inventors: Masayuki Yoshida, Shunji Aoki, Junichi Sutoh, Genichi Watanabe
  • Patent number: 7540931
    Abstract: An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: June 2, 2009
    Assignee: TDK Corporation
    Inventors: Masayuki Yoshida, Junichi Suto, Shunji Aoki, Genichi Watanabe
  • Patent number: 7387870
    Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: June 17, 2008
    Assignee: TDK Corporation
    Inventors: Masayuki Yoshida, Junichi Sutoh, Shunji Aoki, Genichi Watanabe
  • Patent number: 7326310
    Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: February 5, 2008
    Assignee: TDK Corporation
    Inventors: Masayuki Yoshida, Junichi Sutoh, Shunji Aoki, Genichi Watanabe
  • Patent number: 7232496
    Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: June 19, 2007
    Assignee: TDK Corporation
    Inventors: Masayuki Yoshida, Shunji Aoki, Junichi Sutoh, Genichi Watanabe
  • Publication number: 20060223331
    Abstract: The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
    Type: Application
    Filed: April 14, 2004
    Publication date: October 5, 2006
    Applicant: TDK CORPORATION
    Inventors: Masayuki Yoshida, Shunji Aoki, Junichi Sutoh, Genichi Watanabe
  • Publication number: 20060213602
    Abstract: An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.
    Type: Application
    Filed: January 30, 2004
    Publication date: September 28, 2006
    Applicant: TDK CORPORATION
    Inventors: Masayuki Yoshida, Junichi Suto, Shunji Aoki, Genichi Watanabe
  • Publication number: 20050194084
    Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 8, 2005
    Applicant: TDK Corporation
    Inventors: Masayuki Yoshida, Shunji Aoki, Junichi Sutoh, Genichi Watanabe
  • Publication number: 20050079450
    Abstract: There is provided a sheet used for manufacturing multilayer electronic parts in which accuracy in shape and formation position and uniformity in thickness of a complex configuration with recesses and projections of an insulating layer or the like are assured. A layer made of a photosensitive material containing a powder having a specific electric characteristic is formed on a light transmissive base member. A mask having a plurality of patterns with different transmittances for ultraviolet light is disposed on the back side of the base member. The photosensitive material is subjected to an exposure process in which it is irradiated with ultraviolet light or the like through the mask. The photosensitive material is subjected to development process after the exposure process.
    Type: Application
    Filed: August 26, 2004
    Publication date: April 14, 2005
    Applicant: TDK CORPORATION
    Inventors: Masayuki Yoshida, Junichi Sutoh, Shunji Aoki, Genichi Watanabe
  • Publication number: 20050048415
    Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.
    Type: Application
    Filed: August 26, 2004
    Publication date: March 3, 2005
    Applicant: TDK CORPORATION
    Inventors: Masayuki Yoshida, Junichi Sutoh, Shunji Aoki, Genichi Watanabe
  • Publication number: 20050045268
    Abstract: The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.
    Type: Application
    Filed: August 26, 2004
    Publication date: March 3, 2005
    Applicant: TDK CORPORATION
    Inventors: Masayuki Yoshida, Junichi Sutoh, Shunji Aoki, Genichi Watanabe