Abstract: A solder paste stenciling apparatus for minimizing residue of solder paste has a stencil disposed above a substrate in a proper distance. Multiple stencil opens are defined through the stencil and distributed in a predetermined formation. A squeegee for applying solder paste onto the stencil has a hollow body for receiving the solder paste. A piston is used to apply pressure to the solder paste in the body so that the solder paste is urged to flow through an outlet defined in a bottom surface of the body. Two blowers are mounted on opposite sides of the body and a vent is defined in each blower. In operation, the solder paste flows out of the body via the outlet and into the stencil opens to be further deposited onto the substrate. Then, air coming out of the blowers assists the solder paste to be fully evacuated from the stencil opens.