Patents by Inventor Genki SAWADA

Genki SAWADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 11769747
    Abstract: In one embodiment, a semiconductor device includes a first insulator. The device further includes a first pad provided in the first insulator, and including first and second layers provided on lateral and lower faces of the first insulator in order. The device further includes a second insulator provided on the first insulator. The device further includes a second pad provided on the first pad in the second insulator, and including third and fourth layers provided on lateral and upper faces of the second insulator in order. The device further includes a first portion provided between an upper face of the first pad and a lower face of the second insulator or between a lower face of the second pad and an upper face of the first insulator, and including a metal element same as a metal element included in the first layer or the third layer.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: September 26, 2023
    Assignee: Kioxia Corporation
    Inventors: Genki Sawada, Masayoshi Tagami, Jun Iijima, Ippei Kume, Kiyomitsu Yoshida
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220189905
    Abstract: In one embodiment, a semiconductor device includes a first insulator. The device further includes a first pad provided in the first insulator, and including first and second layers provided on lateral and lower faces of the first insulator in order. The device further includes a second insulator provided on the first insulator. The device further includes a second pad provided on the first pad in the second insulator, and including third and fourth layers provided on lateral and upper faces of the second insulator in order. The device further includes a first portion provided between an upper face of the first pad and a lower face of the second insulator or between a lower face of the second pad and an upper face of the first insulator, and including a metal element same as a metal element included in the first layer or the third layer.
    Type: Application
    Filed: June 17, 2021
    Publication date: June 16, 2022
    Applicant: Kioxia Corporation
    Inventors: Genki SAWADA, Masayoshi TAGAMI, Jun IIJIMA, Ippei KUME, Kiyomitsu YOSHIDA