Abstract: Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back plate forms a variable capacitor, the diaphragm comprises multiple first through holes and air release structures respectively corresponding to the first through holes, and the diaphragm further comprises one or more second through holes penetrating through the diaphragm.

Abstract: A dual-diaphragm differential capacitive microphone includes: a back plate, a first diaphragm, and a second diaphragm. The first diaphragm is insulatively supported on a first surface of the back plate, where the back plate and the first diaphragm form a first variable capacitor. The second diaphragm is insulatively supported on a second surface of the back plate, where the back plate and the second diaphragm form a second variable capacitor. The back plate is provided with at least one connecting hole. The second diaphragm is provided with a recess portion recessed towards the back plate, where the recess portion passes through the connecting hole and is connected to the first diaphragm. The dual-diaphragm differential capacitive microphone achieves a higher signal-to-noise ratio.

Abstract: A dual-diaphragm differential capacitive microphone includes: a back plate, a first diaphragm, and a second diaphragm. The first diaphragm is insulatively supported on a first surface of the back plate, where the back plate and the first diaphragm form a first variable capacitor. The second diaphragm is insulatively supported on a second surface of the back plate, where the back plate and the second diaphragm form a second variable capacitor. The back plate is provided with at least one connecting hole. The second diaphragm is provided with a recess portion recessed towards the back plate, where the recess portion passes through the connecting hole and is connected to the first diaphragm. The dual-diaphragm differential capacitive microphone achieves a higher signal-to-noise ratio.

Abstract: A chip assembly for measuring an electrochemical reaction on a solid-liquid phase interface in situ, comprising a first electrode, a second electrode, a first insulating film, a second insulating film, a third insulating film, a fourth insulating film and an upper chip and a lower chip which are oppositely arranged and of which two sides are correspondingly combined in a sealing manner; a through hole is provided on the upper chip; the first insulating film under the through hole is provided with the first electrode; a groove opposite to the through hole is provided on the lower chip; and the fourth insulating film arranged at one side of the groove is provided with the second electrode. The chip assembly dispenses with a specially-made sample rod, thereby substantially reducing test cost; and meanwhile, a lattice structure of a first electrode is also beneficial for observing topography change of a to-be-tested sample.