Abstract: An electrical connector includes: a longitudinal insulating housing; plural differential-pair signal terminals and plural grounding terminals arranged in a longitudinal direction of the insulating housing; and a grounding plate module retained in the insulating housing, wherein the grounding plate module has an electromagnetic interference (EMI) absorber and a grounding plate retained in the EMI absorber, and the grounding plate defines plural grounding fingers extending out of the EMI absorber to contact with corresponding grounding terminals.

Abstract: A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

Abstract: A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

Abstract: An microfluidic device includes a substrate (1) having a wandering groove (12) formed on a first surface (11) thereof; a shielding member (2) abutting on the first surface and covering the groove to form a flow channel (101) to deliver blood; an inlet (14) at one end of the flow channel for introducing the blood into the flow channel; and an outlet (16) at another end of the flow channel for discharging the blood. The flow channel (101) has a detecting region (102) for the blood passing through separately, the detecting region includes an entry (1021) for a single cell entering into at a time and an exit (1022) for a single cell exiting out at a time. A pair of electrodes (211) are disposed between the entry (1021) and the exit (1022) to detect the cells (200) of the blood.

Abstract: An microfluidic device includes a substrate (1) having a wandering groove (12) formed on a first surface (11) thereof; a shielding member (2) abutting on the first surface and covering the groove to form a flow channel (101) to deliver blood; an inlet (14) at one end of the flow channel for introducing the blood into the flow channel; and an outlet (16) at another end of the flow channel for discharging the blood. The flow channel (101) has a detecting region (102) for the blood passing through separately, the detecting region includes an entry (1021) for a single cell entering into at a time and an exit (1022) for a single cell exiting out at a time. A pair of electrodes (211) are disposed between the entry (1021) and the exit (1022) to detect the cells (200) of the blood.

Abstract: An optical module assembly comprises a first optical module and a second optical module engaged with the first optical module. Each of the first and second optical modules comprises a ferrule comprising a first planar surface, a second surface opposite to the first planar surface and at least one connecting mechanism exposed on the second surface of the ferrule, an optical waveguide mounted on the first planar surface of the ferrule, a light guide device coupling to the optical waveguide and disposed on the ferrule, an optical signal transmitted between the first planar surface and the second surface through the light guide device; and wherein the first optical module can be connected with the second optical module by the connecting mechanisms for increasing the transmitting distance of the optical signal.

Abstract: An optical module includes a first switch card (10) having a first optical connector, a second switch card (20) disposed on a side of the first switch card and having a second optical connector, a number of line cards (30) disposed on an opposite side of the first switch card, each of the line cards having a third optical connector, and an optical interconnect assembly having a single fourth optical connector (41) mated with the first optical connector, a single fifth optical connector (45) mated with the second optical connector, a number of sixth optical connectors (43) mated with the third optical connectors, respectively, a number of stacked first optical waveguides (44) connected with the single fourth optical connector and each of the sixth optical connectors, and a number of stacked second optical waveguides connected with the single fifth optical connector and each of the sixth optical connectors.

Abstract: A lens-integrated optical waveguide includes an optical conduit, a lens, and a non-wetting coating underlying the lens. A method for making an lens-integrated optical waveguide includes: forming an optical conduit having an end defining a planar end surface through which lights are transmitted out and received in; injecting a curable glue into a mold to form a pool of curable glues, the mold including a cavity having a concave shape to define a lens outer face; dipping the planar end of the optical conduit into the pool of curable glues; and curing the pool of curable glues onto the planar end surface of the optical conduit.

Abstract: An optical waveguide connector for transmitting light from a laser emitter and to a photo receiver on a circuit board, including a base section having a receiving passageway; a planar waveguide received in the receiving passageway; and a light guide device coupling to the planar waveguide; wherein the planar waveguide has an input waveguide core corresponding to the laser emitter and an output waveguide core corresponding to the photo receiver; wherein the planar waveguide has a smooth front face, the input waveguide core and the output waveguide core extending to the front face; and wherein the light guide device comprises a first reflector proximal to the front face and a second reflector distal from the front face, the second reflector turns the light from the laser emitter toward the input waveguide core, and the first reflector turns the light from the output waveguide core toward the photo receiver.

Abstract: A lens-integrated optical waveguide includes an optical conduit, a lens, and a non-wetting coating underlying the lens. A method for making an lens-integrated optical waveguide includes: forming an optical conduit having an end defining a planar end surface through which lights are transmitted out and received in; injecting a curable glue into a mold to form a pool of curable glues, the mold including a cavity having a concave shape to define a lens outer face; dipping the planar end of the optical conduit into the pool of curable glues; and curing the pool of curable glues onto the planar end surface of the optical conduit.

Abstract: A connector assembly (100) includes an insulative housing (1) having a main portion (11) and a tongue portion (12) extending forwardly from the main portion, the main portion (11) defining a depression (111) and the tongue portion (12) defining a cavity (121), and a column (1110) located in the depression; a fiber device (3) including a base (30), two lenses (33) and two fibers (35), the base enclosing the two lenses and the two fibers connecting to the two lenses, respectively; and the two fibers extending into the depression and crossing each other around the column.

Abstract: A power interconnection system is provided including a printed circuit board (10), a voltage regulator package (30), and an electrical connection socket (20) adapted for receiving a chip package (40) therein. The electrical socket and the voltage regulator package are mounted and electrically coupled to opposite surfaces of the printed circuit board. Thus, the voltage regulator package and the chip package are held in a substantially opposed relationship relative to the printed circuit board after the chip package is mounted onto the socket. Therefore, with such configuration, a lower impedance connection is achieved between the chip package and the voltage regulator package in comparison with the conventional configuration.

Abstract: According to one embodiment of the present invention, an electrical connector (10) includes an insulative housing (15) defining a number of passages (18) and a number of conductive terminals (20) seated in corresponding passages, respectively. The conductive terminal includes a base section (22), a bent section (23) projecting angularly from the base section and having a planar section (26) parallel with the base section, a spring arm (24) sticking upwardly and obliquely out of the passage, and a soldering pad (25) to be mounted on a circuit substrate (28).

Abstract: A power interconnection system is provided including a printed circuit board (10), a voltage regulator package (30), and an electrical connection socket (20) adapted for receiving a chip package (40) therein. The electrical socket and the voltage regulator package are mounted and electrically coupled to opposite surfaces of the printed circuit board. Thus, the voltage regulator package and the chip package are held in a substantially opposed relationship relative to the printed circuit board after the chip package is mounted onto the socket. Therefore, with such configuration, a lower impedance connection is achieved between the chip package and the voltage regulator package in comparison with the conventional configuration.

Abstract: An electrical connector assembly includes a socket (10), spring contacts on the socket, a supporting circuit plate (12), a plurality of capacitor components (13) on the supporting circuit plate, and an integrated circuit package (2) having power delivery lands. The spring contacts includes certain power delivery spring contacts (11) for engagement with corresponding power delivery lands on the package. The socket defines a region for the supporting circuit plate to be retained thereon. The plurality of capacitor components is arranged adjacent the respective power delivery spring contacts, and electrically connected with the capacitor components by the use of the supporting circuit plate. Since the capacitor components are directly incorporated into the socket, the conductive path between a voltage regulation module and the microprocessor package is minimized, thereby minimizing the inductance associated therewith.

Abstract: According to one embodiment of the present invention, an electrical connector (10) includes an insulative housing (15) defining a number of passages (18) and a number of conductive terminals (20) seated in corresponding passages, respectively. The conductive terminal includes a base section (22), a bent section (23) projecting angularly from the base section and having a planar section (26) parallel with the base section, a spring arm (24) sticking upwardly and obliquely out of the passage, and a soldering pad (25) to be mounted on a circuit substrate (28).

Abstract: A land grid array socket (1) comprises an insulative housing (11) having a plurality of passageways (113) extending throughout a top surface (111) and an opposite bottom surface (113) and a plurality of electrical terminals (5) received in corresponding passageways, respectively. Each terminal including a base portion (51) in the passageway and a first spring arm (55) extending out of the top surface of the housing and adapted to be electrically connected with a first electronic component (2) and a second spring arm (54) extending out of the bottom surface of the housing and adapted to be electrically connected with a second electronic component (3). Wherein the first and the second spring arms each has a resisting portion (531, 521), the resisting portions resist the base portion when the spring arms are pressed by the first and the second electronic components so as to form a shorter electrical circuit path between the electronic components.

Abstract: A land grid array socket is provided which includes an insulative housing (22) having a plurality of passageways (24) each accommodating an electrical terminal (1) therein. Contacting ends (134) of the terminal in a same row of the passageways all extend along a predetermined lateral direction, and because of bend of a bending portion (132) in the terminal, the contacting end of the terminal in one passageway does not overlap with another terminal in an adjacent passageway along a vertical direction so as to avoid short circuit risk therebetween.

Abstract: A land grid array socket (1) comprises an insulative housing (11) having a plurality of passageways (113) extending throughout a top surface (111) and an opposite bottom surface (113) and a plurality of electrical terminals (5) received in corresponding passageways, respectively. Each terminal including a base portion (51) in the passageway and a first spring arm (55) extending out of the top surface of the housing and adapted to be electrically connected with a first electronic component (2) and a second spring arm (54) extending out of the bottom surface of the housing and adapted to be electrically connected with a second electronic component (3). Wherein the first and the second spring arms each has a resisting portion (531, 521), the resisting portions resist the base portion when the spring arms are pressed by the first and the second electronic components so as to form a shorter electrical circuit path between the electronic components.