Abstract: A passive microcircuit is made, according to the invention, on a metal substrate, a dielectric layer being coated on at least one of its sides, whereon all components of the passive microcircuit, current-carrying tracks, pads, capacitor electrodes and resistors, are arranged. All the components and a dielectric layer of the passive microcircuit are based on the material of the metal substrate. The proposed passive microcircuit ensures dense wiring, directed heat removal, high reliability and shock- and vibration-proof properties, formation of RC-structures with distributed elements.