Patents by Inventor Genro KATO
Genro KATO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11605869Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: January 26, 2021Date of Patent: March 14, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Publication number: 20220077555Abstract: A transmission line substrate includes a line portion, a base including a first main surface and a second main surface opposite to the first main surface, first and second ground conductors, and a signal line. The first ground conductor is on the first main surface side. The second ground conductor is on the second main surface side. The first ground conductor includes first conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. The second ground conductor includes second conductor-non-formed portions overlapping the signal line when viewed in the Z axis direction. A total area of the second conductor-non-formed portions is less than a total area of the first conductor-non-formed portions.Type: ApplicationFiled: October 29, 2021Publication date: March 10, 2022Inventors: Kosuke OOI, Shingo ITO, Hiromasa KOYAMA, Genro KATO, Kotaro MISHIMA
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Publication number: 20210151845Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: January 26, 2021Publication date: May 20, 2021Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Patent number: 10993329Abstract: A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.Type: GrantFiled: June 24, 2020Date of Patent: April 27, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kuniaki Yosui, Daisuke Tonaru, Hideyuki Taguchi, Genro Kato
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Patent number: 10944145Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: March 30, 2020Date of Patent: March 9, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Publication number: 20200344881Abstract: In a board joint structure, a first board (board) and a component (mounting board) are joined together by a conductive joint material and an insulating joint material. The first board includes a first insulating substrate including a first main surface, a first electrode pad provided on the first main surface, a spacer, and the like. At least a portion of the insulating joint material and the spacer are located between the first board and the component, and the first electrode pad is joined to a second electrode pad of the component with the conductive joint material. A region of the first main surface other than a region where the first electrode pad is provided is joined to the component with the insulating joint material.Type: ApplicationFiled: July 13, 2020Publication date: October 29, 2020Inventors: Daisuke TONARU, Genro KATO, Shinichi ARAKI
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Publication number: 20200323085Abstract: A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.Type: ApplicationFiled: June 24, 2020Publication date: October 8, 2020Inventors: Kuniaki YOSUI, Daisuke TONARU, Hideyuki TAGUCHI, Genro KATO
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Publication number: 20200227806Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: March 30, 2020Publication date: July 16, 2020Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Patent number: 10644370Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: July 17, 2019Date of Patent: May 5, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Publication number: 20190341665Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO
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Patent number: 10424824Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: January 17, 2017Date of Patent: September 24, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Publication number: 20170125870Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: ApplicationFiled: January 17, 2017Publication date: May 4, 2017Inventors: Takahiro BABA, Akihiro KIKUCHI, Genro KATO, Kosuke NISHINO, Nobuo IKEMOTO