Patents by Inventor Gensui TAMURA
Gensui TAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072200Abstract: A method of manufacturing a light-emitting device includes: preparing a light source, which includes: (a) preparing a structure including: a support substrate having a first upper face and including, on the first upper face, a plurality of first terminal parts disposed in the light-emitting part arrangement region, and one or more first wire-connection parts, and a plurality of light-emitting parts disposed in the light-emitting part arrangement region and electrically connected to the first terminal parts, each of the plurality of light-emitting parts having an emission face, (b) disposing a resin member on the first upper face between the light-emitting part arrangement region and the one or more first wire-connection parts in a top view, and (c) disposing a light-shielding member in contact with the resin member while the first wire-connection parts and the emission faces of the light-emitting parts are exposed from the light-shielding member in the top view.Type: ApplicationFiled: August 18, 2023Publication date: February 29, 2024Applicant: NICHIA CORPORATIONInventors: Tetsuya ISHIKAWA, Gensui TAMURA
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Patent number: 11581465Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: GrantFiled: February 12, 2021Date of Patent: February 14, 2023Assignee: NICHIA CORPORATIONInventors: Takuya Nakabayashi, Gensui Tamura
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Publication number: 20230036802Abstract: A planar light source includes a light source having a pair of electrodes on one face; a light guide member covering the light source while the electrodes are exposed from the light guide member; a wiring substrate having a wiring layer; a light reflecting sheet interposed between the light guide member and the wiring substrate and defining a pair of first through holes at positions aligned with the electrodes on a one-to-one basis; and a pair of conducting members respectively disposed in the first through holes and electrically connecting the electrodes to the wiring layer. The light reflecting sheet includes a first light reflecting sheet defining the first through holes, and a second light reflecting sheet defining a second through hole at a position overlapping the first through holes in a plan view with the light source being disposed in the second through hole in the plan view.Type: ApplicationFiled: October 11, 2022Publication date: February 2, 2023Inventor: Gensui TAMURA
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Patent number: 11499684Abstract: A planar light source includes a light source, a light guide member, a wiring substrate, a light reflecting sheet and a pair of conducting members. The light source has a pair of electrodes on one face. The light guide member covers the light source while the electrodes are exposed from the light guide member. The wiring substrate has a wiring layer. The light reflecting sheet is interposed between the light guide member and the wiring substrate and defining a pair of first through holes at positions aligned with the electrodes on a one-to-one basis. The conducting members are respectively disposed in the first through holes and electrically connecting the electrodes to the wiring layer.Type: GrantFiled: April 12, 2021Date of Patent: November 15, 2022Assignee: NICHIA CORPORATIONInventor: Gensui Tamura
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Patent number: 11165006Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.Type: GrantFiled: September 25, 2019Date of Patent: November 2, 2021Assignee: NICHIA CORPORATIONInventors: Toru Hashimoto, Yoichi Bando, Tadaaki Ikeda, Gensui Tamura
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Publication number: 20210317957Abstract: A planar light source includes a light source, a light guide member, a wiring substrate, a light reflecting sheet and a pair of conducting members. The light source has a pair of electrodes on one face. The light guide member covers the light source while the electrodes are exposed from the light guide member. The wiring substrate has a wiring layer. The light reflecting sheet is interposed between the light guide member and the wiring substrate and defining a pair of first through holes at positions aligned with the electrodes on a one-to-one basis. The conducting members are respectively disposed in the first through holes and electrically connecting the electrodes to the wiring layer.Type: ApplicationFiled: April 12, 2021Publication date: October 14, 2021Inventor: Gensui TAMURA
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Publication number: 20210167267Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: ApplicationFiled: February 12, 2021Publication date: June 3, 2021Applicant: NICHIA CORPORATIONInventors: Takuya NAKABAYASHI, Gensui TAMURA
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Patent number: 10950772Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: GrantFiled: June 19, 2020Date of Patent: March 16, 2021Assignee: NICHIA CORPORATIONInventors: Takuya Nakabayashi, Gensui Tamura
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Publication number: 20200321501Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: ApplicationFiled: June 19, 2020Publication date: October 8, 2020Applicant: NICHIA CORPORATIONInventors: Takuya NAKABAYASHI, Gensui TAMURA
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Patent number: 10727387Abstract: Alight emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: GrantFiled: February 19, 2020Date of Patent: July 28, 2020Assignee: NICHIA CORPORATIONInventors: Takuya Nakabayashi, Gensui Tamura
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Publication number: 20200185584Abstract: Alight emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: ApplicationFiled: February 19, 2020Publication date: June 11, 2020Applicant: NICHIA CORPORATIONInventors: Takuya NAKABAYASHI, Gensui TAMURA
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Patent number: 10608154Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: GrantFiled: December 21, 2018Date of Patent: March 31, 2020Assignee: NICHIA CORPORATIONInventors: Takuya Nakabayashi, Gensui Tamura
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Publication number: 20200098964Abstract: The method of manufacturing a light emitting device includes: providing a first intermediate body, the first intermediate body including a temporary substrate including a base and a pair of first wirings, and a light emitting element including a pair of element electrodes, each of the pair of element electrodes connected to a respective one of the first wirings via a respective one of a plurality of solders; removing a portion of the temporary substrate to form a second intermediate body having a second lower surface in which a lower surface of each of the element electrodes and a lower surface of each of the plurality of solders are located; and forming a pair of external connection electrodes on the second lower surface such that each of the pair of external connection electrodes cover a respective one of the element electrodes and a respective one of the plurality of solders.Type: ApplicationFiled: September 25, 2019Publication date: March 26, 2020Applicant: NICHIA CORPORATIONInventors: Toru HASHIMOTO, Yoichi BANDO, Tadaaki IKEDA, Gensui TAMURA
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Publication number: 20190198738Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.Type: ApplicationFiled: December 21, 2018Publication date: June 27, 2019Applicant: NICHIA CORPORATIONInventors: Takuya NAKABAYASHI, Gensui TAMURA
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Patent number: 10243107Abstract: A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.Type: GrantFiled: September 27, 2017Date of Patent: March 26, 2019Assignee: NICHIA CORPORATIONInventors: Tetsuya Ishikawa, Gensui Tamura
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Publication number: 20180090644Abstract: A light emitting device includes a resin molding, first and second leads, and a light emitting element. The resin molding includes a front surface defining an opening, and a lower surface adjacent to the front surface. The first and second leads each includes an outer lead portion and an inner lead portion. The outer lead portion protrudes from the lower surface of the resin molding, and includes a bent portion bent along the lower surface. A surface on an inner side of the bent portion including a first recessed section. The inner lead portion includes an embedded portion embedded in the resin molding, and an exposed portion exposed in the opening. A surface of the embedded portion opposite from the surface where the first recessed section is provided includes a second recessed with a part of the resin molding being positioned in the second recessed section.Type: ApplicationFiled: September 27, 2017Publication date: March 29, 2018Inventors: Tetsuya ISHIKAWA, Gensui TAMURA