Patents by Inventor Geoff A Fuller

Geoff A Fuller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density printed wiring board having in-via surface mounting, pads
    Patent number: 6750404
    Abstract: A multilayer printed wiring board in which surface contact pads are formed by depositing electrically conductive metallic layers directly over blind holes/vias. This allows ball grid array devices to be mounted on the printed wiring boards with a greater contact pad density than is the case where the contact pads are formed to the sides of the blind holes/vias. In a method of manufacturing printed wiring boards embodying the invention, it is desirable to treat the surfaces of the board to prepare the outward facing surfaces of the plated layers of the blind vias to receive copper capping layers.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: June 15, 2004
    Assignee: Nortel Networks Limited
    Inventors: Philip Andrew Anslow, Geoff A Fuller, Ing. Joan Tourne