Abstract: Apparatus suitable for on-wafer probing of microwave integrated circuits includes a coplanar waveguide carried on one surface of an elongate, tapered, dielectric substrate. The waveguide includes a signal conductor extending substantially the length of the substrate and a pair of ground conductors extending along the opposite edges of the signal conductor. The substrate is bonded to a metal mounting block adjacent one end of an coaxial electrical connector. Conductive bonding material, suitably a conductive epoxy material, is applied along the outer edges of the ground conductors to establish a low impedance ground path between the coaxial waveguide and the metal block.

Abstract: Apparatus is provided for mounting an electronic component having a pressure sensitive active area, which apparatus permits the component to expand and contract with changes in temperature and which does not introduce stresses into the active area of the component. The apparatus includes a cradle which, when attached to a substrate, forms a partial enclosure of the component but which leaves the active area unobscured. A packaging system is also provided wherein the bottom of the cavity of the lower portion of a standard integrated circuit package forms the substrate to be used in conjunction with the cradle for containing the electronic component.

Abstract: Two metallic members are connected together over a defined area of respective surfaces of the members by providing at least one layer of metal on at least one of the surfaces. The or each layer of metal has at least one elementary component and is of essentially uniform composition over the defined area, and is of essentially uniform thickness over the defined area. The two surfaces are brought into confronting, contacting relationship, and heat is applied to cause the metal of the or each layer to melt, whereby the members are bonded together by an alloy having a melting point in the range from about 500 degrees C to about 900 degrees C.