Patents by Inventor Geoffrey DeWitt Batchelder

Geoffrey DeWitt Batchelder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Medical device encapsulated within bonded dies
    Patent number: 8172760
    Abstract: An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
    Type: Grant
    Filed: June 18, 2009
    Date of Patent: May 8, 2012
    Assignee: Medtronic, Inc.
    Inventors: Michael F. Mattes, Paul F. Gerrish, Anna J. Malin, Tyler J. Mueller, Geoffrey DeWitt Batchelder, Clark B. Norgaard, Michael A. Schugt, Ralph Danzl, Richard J. O'Brien
  • MEDICAL DEVICE ENCAPSULATED WITHIN BONDED DIES
    Publication number: 20100324614
    Abstract: An implantable medical system includes a first die substrate with a first outer surface. The system also includes a second die substrate with a second outer surface. Furthermore, the system includes a medical device with a first portion that is mounted to the first die substrate and a second portion that is mounted to the second die substrate. The first and second die substrates are fixed to each other and substantially hermetically sealed to each other. Also, the medical device is substantially encapsulated between the first and second die substrates. The first portion is electrically connected to the second portion. Moreover, the first and second outer surfaces of the first and second die substrates are directly exposed to a biological material.
    Type: Application
    Filed: June 18, 2009
    Publication date: December 23, 2010
    Applicant: MEDTRONIC, INC.
    Inventors: Michael F. Mattes, Paul F. Gerrish, Anna J. Malin, Tyler J. Mueller, Geoffrey DeWitt Batchelder, Clark B. Norgaard, Michael A. Schugt, Ralph Danzl, Richard J. O'Brien