Patents by Inventor Geoffrey L. Reid

Geoffrey L. Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board housing clamp
    Patent number: 6975518
    Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: December 13, 2005
    Assignee: Intel Corporation
    Inventors: Kristopher Frutschy, Glenn E. Stewart, Farzaneh Yahyaei-Moayyed, Geoffrey L. Reid
  • Printed circuit board housing clamp
    Publication number: 20030173111
    Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.
    Type: Application
    Filed: May 28, 2003
    Publication date: September 18, 2003
    Applicant: Intel Corporation
    Inventors: Kristopher Frutschy, Glenn E. Stewart, Farzaneh Yahvaei-Moayyed, Geoffrey L. Reid