Abstract: An electronic circuit in which a heat pipe is mounted on a substrate for transporting heat from one region to another, the heat pipe also being secured to the substrate at a plurality of positions along the heat pipe for the purpose of increasing the stiffness of the substrate. The heat pipe may extend across a surface of the substrate or around an edge of the substrate. Heat conductive paths from the heat source may be provided by a ground plane within the substrate or a heat conductor may extend from the heat source to the heat pipe at a position spaced from the substrate.

Abstract: An assembly of a circuit pack and an environmental protection in which the protection is a heat conductive and fluid-tight cover surrounding the pack and sealed to an electrical cover at one end of the pack. The cover is heat conductively connected with the circuit pack and has guide surfaces to enable the assembly to be guided in an electronic shelf. The cover is also provided with handling regions to enable its removal from the shelf and is resistant to buckling. There may be a resilient clip provided at each side edge of the cover. The clip holds the cover in heat conductive engagement with the circuit pack and has an outer surface which acts as a guide surface.

Abstract: In an electronic module two or more circuit packs are included in a housing and are connected to a printed circuit board extending laterally of the circuit packs and also within the housing. The housing is an electromagnetic radiation shield. The printed circuit board has a single connector for connection to a back plane. This structure avoids misalignment and insertion force problems found when two or more packs are housed within a housing and are individually connected to a back plane.

Abstract: In the packaging of devices, such as active and passive electronic devices, the devices can be selectively hermetically sealed or non-hermetically sealed, as desired, using to a large extent common apparatus. In the limit, only the fusion sealing for hermetic devices and plastic encapsulation for non-hermetic devices need be carried out on separate machines. This is obtained by use of a particular form of lead frame, common for both forms of devices, with common apparatus and steps prior to and following the sealing or encapsulation.

Abstract: This invention relates to a novel light emitting diode display of the type comprising a thin substrate, a plurality of light emitting diodes arranged along the substrate, and an electrical conductor pattern on the substrate which electrically interconnects the light emitting diodes so that all or selected ones may be made light emissive. The diodes are arranged along the thin or "thickness" edge of the substrate while the attendant electrical circuit pattern is carried on the side or sides of the substrate. This novel arrangement permits close packing of rows of light sources which heretofore was limited due to the fact that both the circuitry and diodes were carried on the same display face. Novel displays of this invention may also be used as character segments in alpha-numeric character displays.