Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase.

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that tie external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase.

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase.

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shotcount of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract: A passively cooled solid-state laser system for producing high-output power is set forth. The system includes an optics bench assembly containing a laser head assembly which generates a high-power laser beam. A laser medium heat sink assembly is positioned in thermal communication with the laser medium for conductively dissipating waste heat and controlling the temperature of the laser medium. A diode array heat sink assembly is positioned in thermal communication with the laser diode array assembly for conductively dissipating waste heat and controlling the temperature of the laser diode array assembly. The heat sink assemblies include heat exchangers with extending surfaces in intimate contact with phase change material. When the laser system is operating, the phase change material transitions from solid to liquid phase.

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.

Abstract: A laser diode array assembly includes a laser diode array and a memory device integrally packaged with the array. The memory device includes operational information concerning the array. The memory device is accessible by a host external operating system which determines the manner in which the array is to be powered based on the operational information. The memory device may have the capability to be written to such that the external operating system can record in the memory device significant events such as extreme operational conditions, operational faults, and the on-time or shot-count of the array. The assembly may include sensors to which the operating system is coupled. The assembly may further include a processing means to monitor the sensors and provide real-time updates to the external operating system such that laser diode array is continuously powered in an optimal manner.