Abstract: A method of forming a curved semiconductor includes: forming a device layer on a semiconductor substrate; forming a metal layer on the device layer; removing the semiconductor substrate from the device layer; and curving the device layer and the metal layer.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: An isolation system and method are disclosed. The isolation system includes a beam that includes a first end and a second end. The isolation system may include at least one clamping block comprising first elastomeric material, and the first end may be coupled with the first elastomeric material by the at least one clamping block. An end condition of the buckling beam may be varied based on compression stiffening of the first elastomeric material.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.

Abstract: A mechanically actuated transmitter is disclosed. The transmitter can comprise a magnetoelastic member; a magnet adjacent to the magnetoelastic member for inducing magnetization in the magnetoelastic member; a mechanical driver for applying mechanical stress to the magnetoelastic material, thereby changing the magnetic permeability of the magnetoelastic material to change an external magnetic field.

Abstract: The impedance of a loopstick antenna is directly modulated utilizing a mechanically actuated magnetoelastic material preferably placed in the core (or center) of looped wires forming the loopstick antenna. Using one or more mechanical actuators the permeability in the center of the loopstick antenna can be modulated at a rapid rate (such as with data or audio information), allowing the magnetic field outside of the antenna to be modulated at large bandwidths without requiring switches or modulators capable of high voltage thus reducing the overall complexity and cost of the transmitter. The external magnetic field is created by an AC source which is preferably impedance matched to the loopstick antenna by means of a matching network and is FM modulated according to a modulating signal applied to the one or more mechanical actuators.

Abstract: A magnetic transmitter including at least one magnetoelastic element, a magnetic field source, and an actuator operably coupled to the magnetoelastic element. The magnetoelastic element is oriented parallel to the magnetic field source. The magnetic field source is configured to induce a magnetic flux in the magnetoelastic element, and the actuator is configured to induce harmonic vibration in the magnetoelastic element. The magnetoelastic element is oriented parallel to the magnetic field source. The harmonic vibration of the magnetoelastic element is configured to change a net magnetic dipole of the magnetic transmitter due to magnetostriction.

Abstract: A multi-axis isolator configured to isolate a payload from unwanted vibrations and shocks includes a housing, at least one pair of radial isolators in the housing, and an axial isolator in the housing. Each radial isolator includes an elastomer dome, a chamber at least partially defined by the elastomer dome, and a fluid in the chamber. The multi-axis isolator also includes a fluid track placing the chambers of the radial isolators in fluid communication with each other. The axial isolator includes an elastomer dome, a backpressure membrane, a primary chamber, a backpressure chamber, a fluid in the primary and backpressure chambers, a conduit placing the primary chamber in fluid communication with the backpressure chamber. The multi-axis isolator also includes a shaft configured to be connected to the payload. The pair of radial isolators and the axial isolator are coupled to the shaft.

Abstract: A magnetic transmitting antenna has a beam member having a first end and a second end, wherein the beam member comprising: an elastic member; at least one magnetoelastic member disposed on a first surface of the elastic member; and an actuator disposed on a second surface of the elastic member, wherein the actuator is configured to apply stress to the elastic member thereby applying a bending stress thereto for changing the magnetic permeability of the at least one magnetoelastic member, which in turn, changes an external magnetic field. At least one magnet is disposed adjacent to the magnetoelastic member such that magnetization is induced in the magnetoelastic member.

Abstract: Example methods, panels, and systems are disclosed for providing noise insulation. Noise insulation may be provided by an anti-resonant panel that includes a base panel including a base panel core material and two base panel face sheets, where each of the two base panel face sheets is adjacent to an opposite side of the base panel core material. The anti-resonant panel further includes at least one stiffener-member positioned along the base panel in a defined area of the base panel, where the defined area is less than a full area of the base panel. The stiffener-member includes a stiffener-member core material and two stiffener-member face sheets the stiffener-member face sheets adjacent to an opposite side of the stiffener-member core material.

Abstract: An acoustic absorber is disclosed. The acoustic absorber contains a plurality of adjacent passages defined by walls configured to generate alternating high and low pressure zones as an acoustic energy travels though the acoustic absorber.

Abstract: An enclosure is disclosed. The enclosure contains a plurality of walls coupled together and configured to al least partially cover one or more components, wherein at least one of the walls comprises a first plurality of antiresonant membranes configured to at least partially block acoustic emission from the one or more components.

Abstract: A method of manufacturing a hybrid focal-plane array includes: forming a read-out integrated circuit with integral bending slit; forming a detector die separately from the read-out integrated circuit and including a detector with integral bending slit; and joining the read-out integrated circuit and the detector die to each other such that the read-out bending slit and the detector bending slit are aligned with each other.

Abstract: A system configured to provide thermal regulation and vibration isolation to one or more electronic components. The system includes a sensor chassis defining an interior chamber, an electronics housing in the interior chamber of the sensor chassis, a thermoelectric cooler coupled between the sensor chassis and the electronics housing, a thermal strap coupled to the sensor chassis, and at least one isolator coupled to the sensor chassis. The system may also include an insulating material, such as Aerogel, in the interior chamber of the sensor chassis and extending around the electronics housing.

Abstract: An isolator configured to isolate a payload from unwanted vibrations and shocks. The isolator includes a housing having a first end and a second end opposite the first end, a primary chamber defined in the housing, a backpressure chamber defined in the housing, a conduit placing the primary chamber in fluid communication with the backpressure chamber, a backpressure membrane in the housing proximate the first end, an elastomer dome in the housing proximate the second end, and a shaft connected to the elastomer dome. The primary chamber and the backpressure chamber are between the backpressure membrane and the elastomer dome. The shaft is configured to be connected to the payload.

Abstract: A method of manufacturing a curved semiconductor die includes: designing a semiconductor die design by conducting finite element analysis of an initial semiconductor die design having a partial spherical curvature, the initial semiconductor die design including a shape of a semiconductor die and a location and shape of a slit in the semiconductor die; when a size of a gap at the slit in the curved semiconductor die is outside a tolerance, modifying the initial semiconductor die design to provide a revised semiconductor die design and conducting another finite element analysis thereof; when the size of the gap at the slit in the curved semiconductor die is within the tolerance, manufacturing a microfabrication mask utilizing the initial semiconductor die design or the revised semiconductor die design having the size of the gap within the tolerance; forming a semiconductor die by utilizing the microfabrication mask; and curving the semiconductor die.

Abstract: A method of testing a SMA element includes connecting the SMA element to a validation tool, and applying an electrical current to the SMA element over a test cycle. A resistance of the SMA element during the test cycle is measured, while the electrical current is being applied. The measured resistance of the SMA element during the test cycle is correlated to an estimated strain value of the SMA element during the test cycle. A temperature of the SMA element during the test cycle is estimated. A stress in the SMA element during the test cycle is estimated from a stress predicting grid, using the estimated strain value and the estimated temperature of the SMA element during the test cycle. The proper functionality of the SMA element may be determined based on the estimated stress in the SMA element.

Abstract: Ignition-quenching systems comprise an ignition-quenching cover configured to quench an ignition event in a combustible environment triggered by an ignition source associated with a fastener stack. The ignition-quenching cover comprises a porous body that is gas permeable and that has pores sized to quench ignition in the combustible environment. The ignition-quenching cover further comprises a cover attachment feature configured to mate with a fastener attachment feature of the fastener stack. The ignition-quenching cover is configured to cover the fastener stack, which may be associated with a potential ignition source that produces an ignition event in the combustible environment. The porous body may include one or more porous elements that may be formed of various polymeric, mesh, or fabric materials. The ignition-quenching cover may comprise a non-porous frame that is bonded to the porous body and that defines the cover attachment feature.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.