Patents by Inventor Geon Young KIL

Geon Young KIL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
    Patent number: 9462689
    Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
    Type: Grant
    Filed: November 22, 2013
    Date of Patent: October 4, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Geon Young Kil, Myeong Jeong Kim, Jae Man Park, Jong Heum Yoon, Jeung Ook Park, Sung Jin Yun, Jong Sik Lee, Sang A. Ju, Yeo Eun Yoon
  • EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING INSULATING LAYER USING THE EPOXY RESIN COMPOSITION
    Publication number: 20150305152
    Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
    Type: Application
    Filed: November 22, 2013
    Publication date: October 22, 2015
    Inventors: Geon Young KIL, Myeong Jeong KIM, Jae Man PARK, Jong Heum YOON, Jeung Ook PARK, Sung Jin YUN, Jong Sik LEE, Sang A. JU, Yeo Eun YOON