Abstract: A device for detecting sound in the surroundings of an automobile, including a first structure-borne noise sensor, which is acoustically coupled to a first oscillating body at an outside of the automobile and provides a first audio signal, including a second audio signal, which represents sound from an interior of the automobile, and including a processing unit, which is configured to subtract at least the second audio signal from the first audio signal.

Abstract: A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Abstract: A micromechanical sensor device and a corresponding production method include a substrate that has a front and a rear and a plurality of pillars that are formed on the front of the substrate. On each pillar, a respective sensor element is formed, which has a greater lateral extent than the associated pillar. A cavity is provided laterally to the pillars beneath the sensor elements. The sensor elements are laterally spaced apart from each other by respective separating troughs and make electrical contact with a respective associated rear contact via the respective associated pillar.

Abstract: An electronic sensor apparatus for detecting chemical or biological species includes a semiconductor chip, a sensor device, and a substrate. The chip is produced from a semiconductor substrate and is configured for one or more functions such as: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electric current, amplifying and/or evaluating an electrical charge, and amplifying and/or reading out capacitance changes. The sensor device has an active surface configured to detect chemical or biological species and generate an electrical signal based on a species-characteristic interaction with the active surface. The electrical signal can be an electrical voltage, an electric current, an electrical charge and/or a capacitance change. The substrate is produced from a melt-moldable material and has a surface including first and second regions. The chip is at least partly embedded in the first region, and the sensor device is at least partly embedded in the second region.

Abstract: A micromechanical sensor device and a corresponding production method include a substrate that has a front and a rear and a plurality of pillars that are formed on the front of the substrate. On each pillar, a respective sensor element is formed, which has a greater lateral extent than the associated pillar. A cavity is provided laterally to the pillars beneath the sensor elements. The sensor elements are laterally spaced apart from each other by respective separating troughs and make electrical contact with a respective associated rear contact via the respective associated pillar.

Abstract: A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. The at least one converter element is electrically linked to the at least one conductor track via at least one at least partly conductive supporting element arranged between a contact side of the carrier substrate and an inner side of the converter element. The inner side is oriented toward the carrier substrate. The at least one converter element is arranged on the contact side of the carrier substrate such that the inner side of the converter element is kept spaced apart from the contact side of the carrier substrate. The at least one converter element and the conductive structures formed thereon are completely embedded into at least one insulating material.

Abstract: An ultrasound-based measuring device includes a measurement body, at least one ultrasonic transmitter for coupling ultrasonic measurement signals into the measurement body, and at least one ultrasonic receiver for detecting the ultrasonic measurement signals reflected at an end face of the measurement body. The at least one ultrasonic transmitter emits both a longitudinal and a transverse measurement signal. The influence of a physical disturbance variable on the measurement section traversed by the measurement signals during a determination of a measurement pressure prevailing at the end face and/or of a measurement temperature prevailing at the end face can be taken into account on the basis of the propagation times and a difference between the propagation times of the longitudinal and transverse measurement signals reflected at the end face.

Abstract: A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. The at least one converter element is electrically linked to the at least one conductor track via at least one at least partly conductive supporting element arranged between a contact side of the carrier substrate and an inner side of the converter element. The inner side is oriented toward the carrier substrate. The at least one converter element is arranged on the contact side of the carrier substrate such that the inner side of the converter element is kept spaced apart from the contact side of the carrier substrate. The at least one converter element and the conductive structures formed thereon are completely embedded into at least one insulating material.

Abstract: An electronic sensor apparatus for detecting chemical or biological species includes a semiconductor chip, a sensor device, and a substrate. The chip is produced from a semiconductor substrate and is configured for one or more functions such as: amplifying and/or evaluating an electrical voltage, amplifying and/or evaluating an electric current, amplifying and/or evaluating an electrical charge, and amplifying and/or reading out capacitance changes. The sensor device has an active surface configured to detect chemical or biological species and generate an electrical signal based on a species-characteristic interaction with the active surface. The electrical signal can be an electrical voltage, an electric current, an electrical charge and/or a capacitance change. The substrate is produced from a melt-moldable material and has a surface including first and second regions. The chip is at least partly embedded in the first region, and the sensor device is at least partly embedded in the second region.

Abstract: A microelectromechanical sensor module includes a sensing mechanism for measuring an acceleration, pressure, air humidity or the like, a control mechanism for controlling the sensing mechanism, an energy supply mechanism for supplying the sensor module with energy, and a transmission mechanism for transmitting signals of the sensing mechanism. At least three of the mechanisms are integrated at the chip level in at least one chip in each case. A corresponding method is implemented to produce the microelectromechanical sensor module.

Abstract: An ultrasound-based measuring device includes a measurement body, at least one ultrasonic transmitter for coupling ultrasonic measurement signals into the measurement body, and at least one ultrasonic receiver for detecting the ultrasonic measurement signals reflected at an end face of the measurement body. The at least one ultrasonic transmitter emits both a longitudinal and a transverse measurement signal. The influence of a physical disturbance variable on the measurement section traversed by the measurement signals during a determination of a measurement pressure prevailing at the end face and/or of a measurement temperature prevailing at the end face can be taken into account on the basis of the propagation times and a difference between the propagation times of the longitudinal and transverse measurement signals reflected at the end face.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: In the method and device for tuning a first oscillator with a second oscillator respective response signals of the first oscillator are produced from corresponding frequency-shifted and/or phase-shifted signals of the second oscillator. The first oscillator is tuned to the second oscillator according to the difference of the respective response signals. For amplitude correction a quotient is formed by dividing an output signal by the sum of the response signals. The method and device according to the invention are especially useful in a rotation rate sensor. The invention also includes a rotation rate sensor, which includes a device for determining rotation rate from the oscillations of a first and second oscillator and the device for tuning the first oscillator with the second oscillator.

Abstract: A micromechanical device, in particular an acceleration sensor, includes a seismic mass which is resiliently supported on a substrate via a first flexural spring device and which can be deflected in at least one direction by an acceleration, the deflection being able to be limited by a stop device. The stop device has at least one limit stop that is resiliently supported on the substrate via a second flexural spring device, the second flexural spring device having a greater flexural strength than the first flexural spring device.