Patents by Inventor Georg Bogner

Georg Bogner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210245653
    Abstract: In one embodiment, an apparatus may include a light source. The apparatus also includes a measuring laser, such as a semiconductor laser. The measuring laser is configured to generate pulses with a maximum pulse duration of 10 ns. A wavelength of maximum intensity of the measuring laser radiation generated by the measuring laser ranges from 400 nm to 485 nm inclusive. The measuring laser radiation is used for distance measurement by means of LIDAR, for example in a car headlight.
    Type: Application
    Filed: June 6, 2019
    Publication date: August 12, 2021
    Inventors: Joerg Erich Sorg, Hubert Halbritter, Georg Bogner
  • Publication number: 20210083152
    Abstract: The invention relates to various aspects of a ?-LED or a ?-LED array for augmented reality or lighting applications, in particular in the automotive field. The ?-LED is characterized by particularly small dimensions in the range of a few ?m.
    Type: Application
    Filed: September 30, 2020
    Publication date: March 18, 2021
    Inventors: Andreas BIEBERSDORF, Michael BRANDL, Peter BRICK, Jean-Jacques DROLET, Hubert HALBRITTER, Laura KREINER, Erwin LANG, Andreas LEBER, Marc PHILIPPENS, Thomas SCHWARZ, Julia STOLZ, Xue WANG, Karsten DIEKMANN, Karl ENGL, Siegfried HERRMANN, Stefan ILLEK, Ines PIETZONKA, Andreas RAUSCH, Simon SCHWALENBERG, Petrus SUNDGREN, Georg BOGNER, Christoph KLEMP, Christine RAFAEL, Felix FEIX, Eva-Maria RUMMEL, Nicole HEITZER, Marie ASSMANN, Christian BERGER, Ana KANEVCE
  • Publication number: 20200127181
    Abstract: A radiation-emitting semiconductor device and a fabric are disclosed. In an embodiment, a radiation-emitting semiconductor device includes a semiconductor layer sequence having an active region configured to generate radiation and at least one carrier on which the semiconductor layer sequence is arranged, wherein the at least one carrier has at least one anchoring structure on a carrier underside facing away from the semiconductor layer sequence, wherein the at least one anchoring structure includes electrical contact points for making electrical contact with the semiconductor layer sequence, and wherein the at least one anchoring structure is configured to receive at least one thread for fastening the semiconductor device to a fabric and for electrical contacting the at least one thread.
    Type: Application
    Filed: April 18, 2018
    Publication date: April 23, 2020
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Martin Rudolf Behringer, Alexander F. Pfeuffer, Andreas Plößl, Georg Bogner, Berthold Hahn
  • Patent number: 10026880
    Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: July 17, 2018
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: David Racz, Michael Zitzlsperger, Georg Bogner
  • Patent number: 9911719
    Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a molded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the molded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: March 6, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Thomas Schwarz, Frank Singer, Juergen Moosburger, Georg Bogner, Herbert Brunner, Matthias Sabathil, Norwin Von Malm
  • Publication number: 20170263829
    Abstract: An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.
    Type: Application
    Filed: September 8, 2015
    Publication date: September 14, 2017
    Inventors: David Racz, Michael Zitzlsperger, Georg Bogner
  • Patent number: 9666756
    Abstract: An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: May 30, 2017
    Assignee: OSRAM Opto Semiconductors, GmbH
    Inventors: Norwin von Malm, Georg Bogner, Joachim Reill, Stefan Grötsch
  • Publication number: 20170077070
    Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a moulded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the moulded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.
    Type: Application
    Filed: March 31, 2015
    Publication date: March 16, 2017
    Inventors: Thomas SCHWARZ, Frank SINGER, Juergen MOOSBURGER, Georg BOGNER, Herbert BRUNNER, Matthias SABATHIL, Norwin VON MALM
  • Patent number: 9431378
    Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 30, 2016
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Joachim Reill, Georg Bogner, Stefan Grötsch
  • Patent number: 9159889
    Abstract: A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: October 13, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Karl Weidner, Johann Ramchen, Axel Kaltenbacher, Walter Wegleiter, Bernd Barchmann, Stefan Gruber, Georg Bogner
  • Patent number: 9054279
    Abstract: A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: June 9, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Georg Bogner, Stefan Gruber, Thomas Zeiler, Markus Kirsch
  • Patent number: 8994047
    Abstract: An arrangement having at least one optoelectronic semiconductor component includes a carrier element suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body formed from a light-absorbing plastic. The housing body is arranged at the carrier element The housing body comprises an elevated region and a recessed region. An oblique flank is formed between the elevated and recessed regions. The recessed region reaches as far as the optoelectronic semiconductor component in order to reduce reflections.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: March 31, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Georg Bogner, Stefan Gruber, Michael Zitzlsperger
  • Publication number: 20150049510
    Abstract: A radiation-emitting semiconductor component including a volume-emitting semiconductor chip including a first main surface and a second main surface opposite the first main surface, a first reflective element arranged at the first main surface and reflects electromagnetic radiation emerging through the first main surface during operation of the semiconductor chip back to the first main surface, a second reflective element arranged at the second main surface and reflects electromagnetic radiation emerging through the second main surface during operation of the semiconductor chip back to the second main surface, and at least one radiation exit surface through which electromagnetic radiation generated during the operation of the semiconductor component emerges from the semiconductor component, wherein the at least one radiation exit surface runs transversely with respect to the first main surface and the second main surface of the semiconductor chip.
    Type: Application
    Filed: March 12, 2013
    Publication date: February 19, 2015
    Inventors: Luca Haiberger, Georg Bogner
  • Publication number: 20150041834
    Abstract: A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.
    Type: Application
    Filed: October 16, 2014
    Publication date: February 12, 2015
    Inventors: Joachim Reill, Georg Bogner, Stefan Grötsch
  • Patent number: 8916900
    Abstract: An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: December 23, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Georg Bogner, Stefan Gruber
  • Patent number: 8890306
    Abstract: A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 18, 2014
    Assignee: OSRAM Opto Semiconductor GmbH
    Inventors: Joachim Reill, Georg Bogner, Stefan Grötsch
  • Patent number: 8772065
    Abstract: A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: July 8, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Georg Bogner, Karlheinz Arndt
  • Patent number: 8735930
    Abstract: An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: May 27, 2014
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Herbert Brunner, Matthias Winter, Markus Zeiler, Georg Bogner, Thomas Höfer
  • Publication number: 20140098556
    Abstract: An optoelectronic semiconductor module includes a plurality of light-emitting areas, which emit light when in operation. At least two abutting lateral edges of at least one light-emitting area are arranged at an angle of more than 0 degrees and less than 90 degrees to each other. Further embodiments relate to a display having a plurality of such modules.
    Type: Application
    Filed: March 16, 2012
    Publication date: April 10, 2014
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Norwin von Malm, Georg Bogner, Joachim Reill, Stefan Grötsch
  • Patent number: 8664847
    Abstract: At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: March 4, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stefan Groetsch, Georg Bogner, Berthold Hahn, Volker Haerle, Kirstin Petersen