Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract: In various embodiments, a sensor apparatus is provided. The sensor apparatus includes a sensor device having a plurality of electrical contacts; a housing having a plurality of sidewalls; and a metal carrier structure, which extends into the housing in a manner passing through two mutually opposite sidewalls from the plurality of sidewalls. The metal carrier structure is embodied in a resilient fashion at least in the direction of a sidewall through which the metal carrier structure extends. The sensor device having the plurality of electrical contacts is mounted in a resilient fashion on the metal carrier structure and is electrically conductively connected to the metal carrier structure by the plurality of contacts.

Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.

Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

Abstract: A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).

Abstract: A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.

Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.

Abstract: A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation.

Abstract: A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation.

Abstract: The invention relates to an electronic component having an integrated circuit being packaged in a housing. The electronic component is adhesively bonded to an island of a leadframe, the island being designed to accommodate the integrated circuit and being dimensionally adapted to the base surface of the integrated circuit in order to minimize and prevent housing deformations.

Abstract: The invention relates to an electronic device having a semiconductor chip and a leadframe. The leadframe has a flat conductor frame. A semiconductor chip connection plate is configured in the center of the flat conductor frame. The semiconductor chip connection plate is structured by elongate openings all around the position of the semiconductor chip to form an island that carries the semiconductor chip and a ring that surrounds the island. Furthermore, the invention relates to a method for producing such an electronic device and to a corresponding leadframe.

Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.

Abstract: A semiconductor component includes a chip carrier having a first surface, a second surface, and openings therein. At least one semiconductor chip is mounted on the chip carrier. Soldering connection points are formed by at least one metal foil that lines the openings and that extends through the openings. Contact-making points are connected to the semiconductor chip and form electrically conductive connections which extend through the openings in the chip carrier to the soldering connection points. A further metal foil is located between the semiconductor chip and the chip carrier and forms a soldering connection point. The openings include at least one opening that is located underneath the semiconductor chip. The further metal foil extends through the opening that is located underneath the semiconductor chip to the first surface and to the second surface.

Abstract: The invention relates to an electronic device having a semiconductor chip and a leadframe. The leadframe has a flat conductor frame. A semiconductor chip connection plate is configured in the center of the flat conductor frame. The semiconductor chip connection plate is structured by elongate openings all around the position of the semiconductor chip to form an island that carries the semiconductor chip and a ring that surrounds the island. Furthermore, the invention relates to a method for producing such an electronic device and to a corresponding leadframe.

Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks.

Abstract: A semiconductor component includes a chip carrier having a first surface, a second surface, and openings therein. At least one semiconductor chip is mounted on the chip carrier. Soldering connection points are formed by at least one metal foil that lines the openings and that extends through the openings. Contact-making points are connected to the semiconductor chip and form electrically conductive connections which extend through the openings in the chip carrier to the soldering connection points. A further metal foil is located between the semiconductor chip and the chip carrier and forms a soldering connection point. The openings include at least one opening that is located underneath the semiconductor chip. The further metal foil extends through the opening that is located underneath the semiconductor chip to the first surface and to the second surface.