Abstract: A micromechanical acceleration sensor consists of a first semiconductor wafer and a second semiconductor wafer, where on the first semiconductor wafer first and second electrodes, are provided to create a variable capacitance and the second semiconductor wafer has a movable third electrode, and where on the first semiconductor wafer there is a microelectronic evaluation unit. The moveable electrode is a rocker suspended asymmetrically with regard to an axis of rotation such that each respective portion is of a different length and is opposite one of the first and second electrodes. A closed ring structure is disposed on the surface of the first semiconductor wafer.

Abstract: A moving-coil measuring system with a large pointer deflection, utilizing a pole ring having a projection, a pole plate with a projection, a permanent magnet arranged between the projections, and a moving coil embracing the pole ring. The shaft of the coil rotates in two bushings which are concentric with respect to the pole ring. One of the bushings is mounted in the pole plate and the other bushing is mounted in a support fastened to the pole plate.