Abstract: Embodiments are generally directed to package stacking using chip to wafer bonding. An embodiment of a device includes a first stacked layer including one or more semiconductor dies, components or both, the first stacked layer further including a first dielectric layer, the first stacked layer being thinned to a first thickness; and a second stacked layer of one or more semiconductor dies, components, or both, the second stacked layer further including a second dielectric layer, the second stacked layer being fabricated on the first stacked layer.

Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.

Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.

Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.

Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.

Abstract: A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.

Abstract: Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness.

Abstract: An arrangement for cutting a flat workpiece includes a drive unit for generating a relative movement between the focused laser beam (2) and the workpiece (1). The laser beam induces a thermomechanical stress in the workpiece along the cutting line. A scoring tool (7) generates an initial score at the start of the cutting line. A “flying” scoring is provided wherein a unit (5, 6, 8) moves the scoring tool (7). The unit is coupled in a controlled manner to the cutting movement of the laser beam (2) so that the scoring tool (7) can be brought into a short-time scoring working engagement with the workpiece (1) at the start of the cutting movement.

Abstract: The cutting of the flat glass plate (1) into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate (1) is cut apart into partial plates (2-5) along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90° and the partial plates (2-5) are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts (4-9) perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.

Abstract: To shorten the processing time in modern plants for cutting away pieces or sections from a continously moving endless material, e.g. a glass strip, one after the other by flying cutting the cutting bridge carrying the cutting device (6) is accelerated until at a speed within a predetermined tolerance range of the feed speed of the continuously running endless material. Then the cutting bridge speed is synchronized for each piece or section to be cutaway and the cutting away of each piece or section takes place after the synchronization. To attain a very high precision cutting the spacing of the front cut edge formed when the previous piece or section is cut away from the cutting device is measured by means of an image-taking device (7) prior to cutting away of the next piece or section. Then the measured spacing is compared with a set value for the spacing and the speed of the cutting bridge is synchronized or fine tuned according to the comparison prior to cutting away the next piece or section.

Abstract: The cutting of these rectangular plates with predetermined edge lengths is typically effected by means of a laser, which is displaced along the cutting lines, in conjunction with a trailing cooling spot for inducing a thermomechanical stress that is greater than the breaking strength of the glass, and by means of a mechanically induced initial crack at the beginning of the cutting line. When the flat glass plate (1) is in an initial position, a number of parallel first cutting lines (1-3) are made. Afterwards, the flat glass plate (1) that is cut up in such a manner is rotated 90°, and the partial plates (2-5) are moved apart by virtue of the fact that a displaceable table segment of a cutting table is assigned to each partial plate. In this position, several parallel second cuts (4-9) are then made that are perpendicular to the first cuts, whereby, on each partial plate, an initial crack is induced on the leading edge.

Abstract: To shorten the processing time in modern plants for cutting away pieces or sections from a continously moving endless material, e.g. a glass strip, one after the other by flying cutting the cutting bridge carrying the cutting device (6) is accelerated until at a speed within a predetermined tolerance range of the feed speed of the continuously running endless material. Then the cutting bridge speed is synchronized for each piece or section to be cutaway and the cutting away of each piece or section takes place after the synchronization. To attain a very high precision cutting the spacing of the front cut edge formed when the previous piece or section is cut away from the cutting device is measured by means of an image-taking device (7) prior to cutting away of the next piece or section. Then the measured spacing is compared with a set value for the spacing and the speed of the cutting bridge is synchronized or fine tuned according to the comparison prior to cutting away the next piece or section.

Abstract: To shorten the processing time in modern plants for cutting away pieces or sections from a continously moving endless material, e.g. a glass strip, one after the other by flying cutting the cutting bridge carrying the cutting device (6) is accelerated until at a speed within a predetermined tolerance range of the feed speed of the continuously running endless material. Then the cutting bridge speed is synchronized for each piece or section to be cutaway and the cutting away of each piece or section takes place after the synchronization. To attain a very high precision cutting the spacing of the front cut edge formed when the previous piece or section is cut away from the cutting device is measured by means of an image-taking device (7) prior to cutting away of the next piece or section. Then the measured spacing is compared with a set value for the spacing and the speed of the cutting bridge is synchronized or fine tuned according to the comparison prior to cutting away the next piece or section.

Abstract: To shorten the processing time in modern plants for cutting away pieces or sections from a continously moving endless material, e.g. a glass strip, one after the other by flying cutting the cutting bridge carrying the cutting device (6) is accelerated until at a speed within a predetermined tolerance range of the feed speed of the continuously running endless material. Then the cutting bridge speed is synchronized for each piece or section to be cutaway and the cutting away of each piece or section takes place after the synchronization. To attain a very high precision cutting the spacing of the front cut edge formed when the previous piece or section is cut away from the cutting device is measured by means of an image-taking device (7) prior to cutting away of the next piece or section. Then the measured spacing is compared with a set value for the spacing and the speed of the cutting bridge is synchronized or fine tuned according to the comparison prior to cutting away the next piece or section.

Abstract: The method and apparatus for cutting through flat workpieces made of glass can cut through workpieces with greater thickness, e.g. glass panes with a thickness greater than 0.2 mm, than possible up to now with a comparable known method, without micro-fractures, glass fragments or splitter. In the method of the invention a heat radiation spot symmetric to the cutting line is produced on the workpiece. This heat radiation spot has edge portions with elevated radiation intensity and is moved along the cutting line on the workpiece and the heated section of the cutting line is subsequently cooled. A scanner motion produces the heat radiation spot so that edge portions of elevated radiation intensity coincide with a V- or U-shaped curve, which is open at the leading end of the heat radiation spot. The peak portion of the V- or U-shaped curve on the cutting line is at a temperature maximum that is under the melting point of the workpiece material.

Abstract: The method and apparatus for cutting through flat workpieces made of glass can cut through workpieces with greater thickness, e.g. glass panes with a thickness greater than 0.2 mm, than possible up to now with a comparable known method, without micro-fractures, glass fragments or splitter. In the method of the invention a heat radiation spot symmetric to the cutting line is produced on the workpiece. This heat radiation spot has edge portions with elevated radiation intensity and is moved along the cutting line and/or the workpiece and the heated section of the cutting line is subsequently cooled. A scanner motion produces the heat radiation spot so that edge portions of elevated radiation intensity coincide with a V- or U-shaped curve, which is open at the leading end of the heat radiation spot. The peak portion of the V- or U-shaped curve on the cutting line is at a temperature maximum that is under the melting point of the workpiece material.