Abstract: The invention relates to a device for controlling and/or regulating an annealing or heat treatment furnace (2) of a production line (1) processing metal material, which comprises the annealing or heat treatment furnace (2) and at least one measuring instrument (7, 8, 17), which detects at least one material property of a strip material (6) located in the production line (1), wherein the annealing or heat treatment furnace (2) and the at least one measuring instrument (7, 8) interact in a regulating and/or control circuit of an automated process control, which regulates and/or controls the annealing or heat treatment furnace (2) in connection with a furnace control, wherein according to the invention, a solution is created wherein an improvement of the process control over the previously known prior art can be achieved.

Abstract: An optoelectronic semi-conductor chip is disclosed in which an encapsulation layer, which is an ALD layer, completely covers a first mirror layer on the side thereof facing away from a p-conductive region, and is arranged to be in direct contact with said first mirror layer in some sections.

Abstract: An optoelectronic semiconductor chip includes a semiconductor body with an active region provided for generating electromagnetic radiation, a first mirror layer provided for reflecting the electromagnetic radiation, a first encapsulation layer formed with an electrically insulating material, and a carrier provided for mechanically supporting the first encapsulation layer, the first mirror layer and the semiconductor body. The first mirror layer is arranged between the carrier and the semiconductor body. The first encapsulation layer is arranged between the carrier and the first mirror layer. The first encapsulation layer is an ALD layer.

Abstract: An optoelectronic component comprising a semiconductor body, a first connection layer, an insulation layer and a second connection layer, wherein the semiconductor body has an active region for generating electromagnetic radiation and the second connection layer comprises a first partial layer and a second partial layer is specified, wherein the insulation layer electrically insulates the first connection layer from the second connection layer, the first partial layer is arranged between the second partial layer and the semiconductor body in a vertical direction, in a plan view of the semiconductor body the first connection layer overlaps the first partial layer and is spaced apart from the second partial layer in a lateral direction, and the first connection layer has a first layer thickness and the second partial layer has a second layer thickness, wherein the first layer thickness and the second layer thickness differ from one another at most by 20%.

Abstract: An optoelectronic semi-conductor chip is disclosed in which an encapsulation layer, which is an ALD layer, completely covers a first mirror layer on the side thereof facing away from a p-conductive region, and is arranged to be in direct contact with said first mirror layer in some sections.

Abstract: The invention relates to a device for controlling and/or regulating an annealing or heat treatment furnace (2) of a production line (1) processing metal material, which comprises the annealing or heat treatment furnace (2) and at least one measuring instrument (7, 8, 17), which detects at least one material property of a strip material (6) located in the production line (1), wherein the annealing or heat treatment furnace (2) and the at least one measuring instrument (7, 8) interact in a regulating and/or control circuit of an automated process control, which regulates and/or controls the annealing or heat treatment furnace (2) in connection with a furnace control, wherein according to the invention, a solution is created wherein an improvement of the process control over the previously known prior art can be achieved.

Abstract: An optoelectronic semiconductor chip includes a semiconductor body including n-conducting and p-conducting regions, an active region generating electromagnetic radiation, a mirror layer reflecting the electromagnetic radiation, and an encapsulating layer sequence formed with an insulating material, wherein the mirror layer is arranged at an underside of the p-conducting region, the active region is arranged at a side of the p-conducting region facing away from the mirror layer, the n-conducting region is arranged at a side of the active region facing away from the p-conducting region, the encapsulation layer sequence covers the semiconductor body at the outer surface thereof in places, the encapsulation layer sequence extends at the outer surface of the semiconductor body from the active region along the p-conducting region as far as below the mirror layer, and the encapsulation layer sequence includes at least one encapsulation layer which is an ALD layer or consists of an ALD layer.

Abstract: An optoelectronic semiconductor chip includes a semiconductor body with an active region provided for generating electromagnetic radiation, a first mirror layer provided for reflecting the electromagnetic radiation, a first encapsulation layer formed with an electrically insulating material, and a carrier provided for mechanically supporting the first encapsulation layer, the first mirror layer and the semiconductor body. The first mirror layer is arranged between the carrier and the semiconductor body. The first encapsulation layer is arranged between the carrier and the first mirror layer. The first encapsulation layer is an ALD layer.

Abstract: An optoelectronic component comprising a semiconductor body, a first connection layer, an insulation layer and a second connection layer, wherein the semiconductor body has an active region for generating electromagnetic radiation and the second connection layer comprises a first partial layer and a second partial layer is specified, wherein the insulation layer electrically insulates the first connection layer from the second connection layer, the first partial layer is arranged between the second partial layer and the semiconductor body in a vertical direction, in a plan view of the semiconductor body the first connection layer overlaps the first partial layer and is spaced apart from the second partial layer in a lateral direction, and the first connection layer has a first layer thickness and the second partial layer has a second layer thickness, wherein the first layer thickness and the second layer thickness differ from one another at most by 20%.

Abstract: The invention relates to a roll stand comprising at least one roll (1) having a rotation axis (a), said roll being supported in two installed parts (2, 3) disposed in the axial end regions of the roll (1) and each having a center plane (M), wherein the roll (1) can be positioned in the direction perpendicular to the transport direction (F) of the product to be rolled by means of at least one positioning element (4). In order to be able to introduce a bending moment acting counter to the roll bending moment into the roller in a simple manner and without additional elements, according to the invention, each installed part (2, 3) is connected to a bending lever (5, 6) and the positioning element (4) is disposed such that the positioning force thereof is introduced into the bending lever (5, 6) at a location (G) removed from the center plane (M) of the installed part (2, 3), and thereby into the installed part (2, 3).

Abstract: A method of annealing and descaling hot-rolled austenitic stainless steel strip wherein. The steel strip is descaled in a connected plasma descaling installation after annealing and subsequent cooling. The plasma descaling is carried out under vacuum in a plurality of stages, and the steel strip is subjected to a controlled cooling between these stages and after the final stage by means of cooling rolls so that the steel strip has a temperature below 100° C. when exiting the plasma descaling installation. An apparatus to practice the method is also disclosed.

Abstract: The invention relates to a roll stand comprising at least one roll (1) having a rotation axis (a), said roll being supported in two installed parts (2, 3) disposed in the axial end regions of the roll (1) and each having a center plane (M), wherein the roll (1) can be positioned in the direction perpendicular to the transport direction (F) of the product to be rolled by means of at least one positioning element (4). In order to be able to introduce a bending moment acting counter to the roll bending moment into the roller in a simple manner and without additional elements, according to the invention, each installed part (2, 3) is connected to a bending lever (5, 6) and the positioning element (4) is disposed such that the positioning force thereof is introduced into the bending lever (5, 6) at a location (G) removed from the center plane (M) of the installed part (2, 3), and thereby into the installed part (2, 3).

Abstract: The invention relates to a method of stabilizing a strip guided between stripping dies of a hot-dip coating installing and provided with a coating, and also to a corresponding hot-dip coating installation. In this context, stabilizing forces are applied to the strip on the basis of the detected strip position by coils which are arranged downstream of the stripping dies in the strip displacement direction and act electromagnetically and in a contactless manner on the displaceable steel strip. In order to improve the stabilization of the strip in the region of the stripping die, the invention proposes that the distance between the line of action of the strip-stabilizing means and the stripping dies be adjusted to a value?a distance threshold value which is determined as a function of the strip width taking into account a coefficient ?, wherein the coefficient ? is calculated as a function of the strip thickness and the strip tension.

Abstract: A method for hot dip coating metal strip includes guiding the strip obliquely or vertically through a molten coating metal. The coating thickness is controlled after the strip has emerged from the coating bath, and thin metal strip, which has a tendency to vibrate, is sealed towards the bottom by an electromagnetic traveling field that acts as a sealing field while the coating is laterally guided to compensate for ferromagnetic attraction. The electromagnetic field of one or more main coils in each inductor generates the electromagnetic traveling field as a blocking field or as a pump field, and several correction fields are arranged within the magnet yoke surface. The correction fields are individually determined according to width levels of the metal strip and are distributed according to a production program, and the correction fields are activated by separate pieces of power supply equipment.

Abstract: The present invention relates to an apparatus for hot-dip coating of a metal strand, in particular a steel strip, in which the metal strand (1) passes vertically through a vessel containing a melted coating metal (2) and an upstream guide channel (4) in a region of which at least two inductors (5) for producing an electromagnetic field are arranged on both sides of the metal strand (1) for retaining the coating metal (2) in the vessel and an increased volume of the coating metal (2) is available in at least one section (4a). For killing the coating metal bath, according to the invention, the increased volume is provided in a region of the magnetic field of the inductors (5).

Abstract: The invention relates to a method for straightening a metal strip (1) which is guided in the direction of transportation (R) through a straightening machine (2) and is straightened. In the straightening device (2), the metal strip (1) is impinged upon by a straightening force (F) which is applied by a plurality of straightening rollers (3) in the direction (N) which is perpendicular to the surface of the metal strip (1). According to the invention, prior to the metal strip (1) entering into the straightening machine (2), the thickness (d) of the metal strip (1) is determined and the position (a) of the straightening rollers (3) in the direction (N) which is perpendicular to the surface of the metal strip (1) is taken into account according to the determined thickness (d).

Abstract: The invention relates to a device for hot dip coating a metal bar (1), especially a steel strip, in which the metal bar (1) is directed vertically through a container (3) accommodating the molten coating metal (2) and through a guide channel (4) mounted upstream thereof. The inventive device comprises at least two inductors (5) which are arranged on both sides of the metal bar (1) in the area of the guide channel (4) and generate an electromagnetic field for retaining the coating metal (2) inside the container (3). In order to relax the coating bath, the distance (d) between the walls (6) that delimit the guide channel (4) is not kept constant in a direction (N) extending perpendicular to the surface of the metal strip (1) in the zone (H) of the vertical extension of the guide channel (4), which is located between the bottom side (7) thereof and the bottom area (8) of the container (3).

Abstract: The invention relates to a method of a cleaning a metal strip (1). In order to improve the cleaning of the strip, according to the invention, it is provided that the metal strip (1) is first subjected to a first high-pressure cleaning (4) with at least one liquid jet in a first region (2) of a cleaning device (3), and in that the metal strip (1) thereafter is subjected to an ultrasonic cleaning (6) in a second region off the cleaning device (3), at which the metal strip (1) is displaced through a container filled with liquid. The invention further relates to a device for cleaning a metal strip.

Abstract: The invention relates to a method for hot-dip coating a metal strip (1), particularly a steel strip, in which the metal strip (1) is fed to a receptacle (5) accommodating the melted coating metal (4) through a hole (6) in the bottom area of the receptacle (5) after passing through a furnace (2) and a roll chamber (3) that adjoins the furnace (2) in the direction of travel (F) of the metal strip (1). An electromagnetic field is generated in the bottom area of the receptacle (5) so as to retain the coating metal (4) in the receptacle (5). In order to obtain more advantageous operating conditions especially in case the performance of the hot-dip coating system drops, different gas atmospheres are maintained in at least two separate spaces (7, 8) of the roll chamber (3). The invention further relates to a hot-dip coating device.

Abstract: The invention relates to a method for straightening a metal strip (1) which is guided in the direction of transportation (R) through a straightening machine (2) and is straightened. In the straightening device (2), the metal strip (1) is impinged upon by a straightening force (F) which is applied by a plurality of straightening rollers (3) in the direction (N) which is perpendicular to the surface of the metal strip (1). According to the invention, prior to the metal strip (1) entering into the straightening machine (2), the thickness (d) of the metal strip (1) is determined and the position (a) of the straightening rollers (3) in the direction (N) which is perpendicular to the surface of the metal strip (1) is taken into account according to the determined thickness (d).