Abstract: A de-exciting system for dissipating energy from an inductive circuit that comprises at least one coil adapted to be attached to said inductive circuit and comprising a series connection of a discharge resistor and a unidirectional discharge switching element; a unidirectional bypass switching element that is connected in parallel to the discharge resistor such that, when the de-exciting system is attached to the inductive circuit and both the discharge switching element and the bypass switching element are in a conducting state, a closed conducting path comprising the coil, the discharge switching element, and the bypass switching element is formed; and a control device configured to, in a first de-excitation phase, switch both the discharge switching element and the bypass switching element into a conducting state, and in a second de-excitation phase, switch the bypass switching element into a non-conducting state, while keeping the discharge switching element in the conducting state.

Abstract: A de-exciting system for dissipating energy from an inductive circuit that comprises at least one coil adapted to be attached to said inductive circuit and comprising a series connection of a discharge resistor and a unidirectional discharge switching element; a unidirectional bypass switching element that is connected in parallel to the discharge resistor such that, when the de-exciting system is attached to the inductive circuit and both the discharge switching element and the bypass switching element are in a conducting state, a closed conducting path comprising the coil, the discharge switching element, and the bypass switching element is formed; and a control device configured to, in a first de-excitation phase, switch both the discharge switching element and the bypass switching element into a conducting state, and in a second de-excitation phase, switch the bypass switching element into a non-conducting state, while keeping the discharge switching element in the conducting state.

Abstract: The present invention relates to a dome (10) for use with a receiver assembly (20). The dome (10) comprises a core (12) and a shell (14), wherein the core (12) and the shell (14) are made of different materials, the material of the core (12) is rigid and the material of the shell (14) is soft, and wherein the dome (10) is connectable to the receiver assembly (20) by means of a threaded connection (34). Therefore, connecting and separating the dome (10) to and from the receiver assembly (20) can be simplified in a secure and easy operation performed by the user.

Abstract: A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

Abstract: A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

Abstract: A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.

Abstract: A lead-through or connecting element is provided that includes an assembly having a carrier body of a high-temperature alloy, a functional element, and an at least partially crystallized glass. The crystallized glass is between a portion of the functional element and a portion of the carrier body. The carrier body subjects the crystallized glass to a compressive stress of greater than or equal to zero, at a temperature from at least 20° C. to more than 450° C. Also provided are a method for producing a lead-through or connecting element, the use of such a lead-through or connecting element, and to a measuring device including such a lead-through or connecting element.