Abstract: A package includes: a semiconductor element; a case having an opening and housing the semiconductor element; and a lid having a rectangular parallelepiped shape and occluding the opening of the case. In the package, the lid is joined to an end portion of the opening of the case, and includes a bent portion surrounded by a portion joining the lid to the case and extending along a longitudinal side of the lid.

Abstract: A package includes: a semiconductor element; a case having an opening and housing the semiconductor element; and a lid having a rectangular parallelepiped shape and occluding the opening of the case. In the package, the lid is joined to an end portion of the opening of the case, and includes: a bent portion formed in a more interior position on the lid than a joint portion corresponding to a longitudinal side and along the joint portion corresponding to the longitudinal side, in a top view, among sides of the lid which are joined to the case; and a flat portion not including a bent portion formed in a more interior position on the lid than a joint portion corresponding to a short side and along the joint portion corresponding to the short side, in the top view, among the sides of the lid which are joined to the case.