Patents by Inventor Georg Schaefer

Georg Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9334356
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: May 10, 2016
    Assignee: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Patent number: 8535811
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer
  • Publication number: 20120196113
    Abstract: The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 ?m, which is suitable for producing dimensionally stable circuit boards.
    Type: Application
    Filed: October 19, 2010
    Publication date: August 2, 2012
    Applicant: Evonik Degussa GmbH
    Inventors: Joerg Blaschke, Kirsten Luetzeler, Walter Zink, Ricardo Luiz Willemann, Kathrin Salwiczek, Georg Schaefer
  • Patent number: 8003201
    Abstract: A polyamide molding composition which can be used for production of a printable or printed item contains a) at most 90 parts by weight of a polyamide obtained from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PA1010, wherein a total of components a) and b) is 100 parts by weight.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: August 23, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Kirsten Luetzeler, Franz-Erich Baumann, Sonja Bollmann, Andreas Dowe, Roland Wursche, Georg Schaefer