Patents by Inventor Georg Schubert

Georg Schubert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming moldings from dimer fatty acid free polyamides
    Patent number: 6960315
    Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: November 1, 2005
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Bettina Becker, Angela Rossini, Thomas Moeller, Thomas Huver, Georg Schubert
  • Moulded parts made of polyamides which are free of dimeric acids
    Publication number: 20030173707
    Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.
    Type: Application
    Filed: February 12, 2003
    Publication date: September 18, 2003
    Inventors: Bettina Becker, Angela Rossini, Thomas Moeller, Thomas Huver, Georg Schubert
  • Moldings of polyurethane hotmelt adhesives
    Patent number: 5776406
    Abstract: The invention relates to the use of moisture-curing PU hotmelt adhesives as molding compounds for the production of moldings, the PU hotmelt adhesives having a melt viscosity of less than 100 Pa.multidot.s at the processing temperature of 70.degree. to 190.degree. C. To produce the moldings, the molding compound is melted at temperatures of 70.degree. to 200.degree. C., the melt is injected into closed molds under an excess pressure of 1 to 50 bar, the cooled moldings are removed from the mold after a short time and are then cured with atmospheric moisture. Economic and technical advantages include distinctly lower processing pressures, expense on machinery and tooling and firm adhesion to various substrates. The moldings are heat-resistant and adhere to various substrates. They are particularly suitable for the production of electrical components.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: July 7, 1998
    Assignee: Henkel Dommanditgesellschaft auf Aktien
    Inventors: Georg Schubert, Michael Krebs, Karin Jonscher, Roland Heider