Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: Plastics line consisting of three layers, an inner layer (3) bordering the interior (2), a middle layer (4) directly adjoining the inner layer (3), and an outer layer (5) directly adjoining the middle layer (4), where the inner layer (3) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof, the middle layer (4) is formed on the basis of PA612 and/or PA616 or consists substantially thereof, the outer layer (5) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The invention relates to polyamide moulding compounds containing the following components (A) to (D) or consisting of these components: (A) between 50 and 98 wt. % of at least one polyamide selected from the group consisting of PA 516, PA 616, PA 1016 and mixtures thereof; (B) between 0 and 30 wt. % of at least one polyamide selected from the group consisting of PA 11, PA 12, PA 416, PA 516, PA 69, PA 610, PA 612, PA 614, PA 616, PA 618, PA 816, PA 1010, PA 1012, PA 1014, PA 1016, PA 1018, PA 1212, PA 1216, PA 1218 and mixtures thereof; (C) between 2 and 25 wt. % of at least one specific impact modifier; and (D) between 0 and 20 wt. % of at least one additive; the sum of the constituent amounts of the components (A) to (D) amounting to 100 wt. %.

Abstract: The invention relates to the use of thermoplastic polyamide molding compounds to reduce the formation of solid deposits and/or coatings on tools used in thermoplastic shaping to form useful objects in discontinuous processes, in particular in injection molding, and used in continuous processes such as extrusion to form films, fibers, tubes and casings. The molding compounds used are based on polyamides which are largely based on the polyamide units (616, 516) or (916). By virtue of the use of the polyamide molding compounds according to the invention, the solid deposits and/or coatings that otherwise commonly occur in the further processing of polyamide (12) during injection molding or during extrusion, are greatly reduced or prevented.

Abstract: The present invention relates to polyketone molding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof molding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The molding compounds fulfill the fire protection classification V0 according to UL94 and display good mechanical properties. These molding compounds are suitable for the production of in particular thin-walled molded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: A description is given of thermoplastic, white-pigmented plastics moulding compositions having improved mechanical properties, especially for LDS applications. The thermoplastic moulding composition consists of: (A) 20-88 wt % of a mixture consisting of (A1) 60-100 wt % of a thermoplastic (A2) 0-40 wt % of a mixture of (A2_1) 0-40 wt % of a thermoplastic other than (A1); (A2_2) 0-40 wt % of impact modifiers other than (A1) and (A2_1); (B) 10-70 wt % of fibrous adjuvants; (C) 0.1-10 wt % of an LDS additive or of a mixture of LDS additives, at least one LDS additive being selected from the following group: metal oxide based on copper, neodymium, molybdenum, bismuth, antimony or tin, with the proviso that spinels are excluded; metal phosphate; metal hydroxide phosphate; (D) 0.1-20 wt % of white pigment; (E) 0-20 wt % of particulate filler other than C and/or D; (F) 0-2 wt % of further, different additives; the sum of (A)-(F) making up 100 wt %.

Abstract: Polyamide moulding composition in particular for railway applications consisting of: (A) from 50 to 90% by weight of a polyamide matrix consisting of (A1) polyamide 12 and optionally (A2) up to 85% by weight of polyamide elastomer based on polyamide 12; (B) from 7 to 28% by weight of flame retardant consisting of (B1) at least one metal phosphinate, and also optionally (B2) up to 40% of a nitrogen-containing synergist and/or at least one nitrogen- and phosphorus-containing flame retardant; (C) from 3 to 15% by weight of plasticizer; (D) from 0 to 15% by weight polyolefin; (E) from 0 to 10% by weight of additives and/or particulate fillers, with exclusion of fibrous reinforcing materials; where the entirety of (C) and (D) is from 3 to 20% by weight, based on the entire moulding composition, and where the entirety of (A) to (E) provides 100% by weight.

Abstract: A molding compound consisting of the components: (A)-(E), wherein the sum of (A)-(E) makes up 100 wt. %. Component A is 40-70 wt. % of at least one partially crystalline polyamide, made up of: (a1) 60-75 wt. % of 6T units; (a2) 20-35 wt. % of 6I units; (a3) 3-15 wt. % of 612 units; (a4) 0-5 wt. % of one of the following units: 66; 68; 69; 610; 6; or a mixture of such units; wherein the sum of (a1) to (a4) makes up 100 wt. % of (A). Component (B) is 30-60 wt. % of fibrous reinforcing materials. Component (C) is 0-30 wt. % of particulate fillers different from (B), (D) and (E). Component (D) is 0-2.0 wt. % of heat stabilizers, and component (E) is 0-6 wt. % of auxiliary agents and/or additives, different from (A)-(D).

Abstract: Plastics line consisting of three layers, an inner layer (3) bordering the interior (2), a middle layer (4) directly adjoining the inner layer (3), and an outer layer (5) directly adjoining the middle layer (4), where the inner layer (3) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof, the middle layer (4) is formed on the basis of PA612 and/or PA616 or consists substantially thereof, the outer layer (5) is formed on the basis of a mixture of at least two polyamides selected from the following group: PA12, PA612, PA616, or consists substantially thereof.