Abstract: A method for calibrating a visual-inertial tracking system is described. A device operates the visual-inertial tracking system without receiving a tracking request from a virtual object display application. In response to operating the visual-inertial tracking system, the device accesses sensor data from sensors at the device. The device identifies, based on the sensor data, a first calibration parameter value of the visual-inertial tracking system and stores the first calibration parameter value. The system detects a tracking request from the virtual object display application. In response to the tracking request, the system accesses the first calibration parameter value and determines a second calibration parameter value from the first calibration parameter value.

Abstract: The present invention includes an apparatus for determining and/or monitoring a process variable, especially the temperature, or the flow, of a medium in a containment, including a temperature sensor for registering temperature and a flexible, a heat insulating support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

Abstract: The present disclosure relates to an apparatus for determining and/or monitoring a temperature of a medium in a containment, including a temperature sensor for registering temperature, and a flexible, heat-conductive support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

Abstract: An apparatus for determining and/or monitoring a process variable, for example, temperature, flow or flow velocity, of a medium in a containment includes a temperature sensor for registering temperature securable to an outer surface of the wall of the containment, at least one connection line for electrical contacting of the temperature sensor, and securement means for a releasable securing of the temperature sensor and a temperature sensor-near section of the connection line to the outer surface of the wall of the containment. According to the present disclosure, at least the section of the connection line is securable to the outer surface of the wall of the containment such that the section extends parallel with the wall of the and is in thermal contact with the wall of the containment.

Abstract: A method for manufacturing a magnetic memory array provides back end of line annealing for associated processing circuitry without causing thermal damage to magnetic memory elements of the magnetic memory array. An array of magnetic memory element pillars is formed on a wafer, and the magnetic memory elements are surrounded by a dielectric isolation material. After the pillars have been formed and surrounded by the dielectric isolation material an annealing process is performed to both anneal the memory element pillars to form a desired grain structure in the memory element pillars and also to perform back end of line thermal processing for circuitry associated with the memory element array.

Abstract: The disclosure provides a magnetic random access memory element. The magnetic random access memory element includes a magnetic reference layer, a magnetic free layer, and a non-magnetic barrier layer between the magnetic free layer and the magnetic reference layer. The magnetic random access memory element further includes a MgO layer contacting the magnetic free layer. The MgO layer includes multiple homogeneous layers of MgO that provide excellent interfacial perpendicular magnetic anisotropy to the magnetic free layer while also having a low RA.

Abstract: The present disclosure relates to an apparatus for determining and/or monitoring a temperature of a medium in a containment, including a temperature sensor for registering temperature, and a flexible, heat-conductive support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

Abstract: An apparatus for determining and/or monitoring a process variable, for example, temperature, flow or flow velocity, of a medium in a containment includes a temperature sensor for registering temperature securable to an outer surface of the wall of the containment, at least one connection line for electrical contacting of the temperature sensor, and securement means for a releasable securing of the temperature sensor and a temperature sensor-near section of the connection line to the outer surface of the wall of the containment. According to the present disclosure, at least the section of the connection line is securable to the outer surface of the wall of the containment such that the section extends parallel with the wall of the and is in thermal contact with the wall of the containment.

Abstract: The invention relates to an apparatus for determining and/or monitoring a temperature of a medium in a containment, comprising a measuring insert having a temperature sensor for registering temperature, a protective tube, in which the temperature sensor is arranged, and a heat conductive, formed piece, which is arranged in the protective tube and surrounds the measuring insert at least sectionally.

Abstract: The present invention includes an apparatus for determining and/or monitoring a process variable, especially the temperature, or the flow, of a medium in a containment, including a temperature sensor for registering temperature and a flexible, a heat insulating support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

Abstract: A method for manufacturing a magnetic memory array provides back end of line annealing for associated processing circuitry without causing thermal damage to magnetic memory elements of the magnetic memory array. An array of magnetic memory element pillars is formed on a wafer, and the magnetic memory elements are surrounded by a dielectric isolation material. After the pillars have been formed and surrounded by the dielectric isolation material an annealing process is performed to both anneal the memory element pillars to form a desired grain structure in the memory element pillars and also to perform back end of line thermal processing for circuitry associated with the memory element array.

Abstract: The disclosure provides a magnetic random access memory element. The magnetic random access memory element includes a magnetic reference layer, a magnetic free layer, and a non-magnetic barrier layer between the magnetic free layer and the magnetic reference layer. The magnetic random access memory element further includes a MgO layer contacting the magnetic free layer. The MgO layer includes multiple homogeneous layers of MgO that provide excellent interfacial perpendicular magnetic anisotropy to the magnetic free layer while also having a low RA.

Abstract: A method for manufacturing a magnetic memory array provides back end of line annealing for associated processing circuitry without causing thermal damage to magnetic memory elements of the magnetic memory array. An array of magnetic memory element pillars is formed on a wafer, and the magnetic memory elements are surrounded by a dielectric isolation material. After the pillars have been formed and surrounded by the dielectric isolation material an annealing process is performed to both anneal the memory element pillars to form a desired grain structure in the memory element pillars and also to perform back end of line thermal processing for circuitry associated with the memory element array.

Abstract: A method for manufacturing a magnetic random access memory element having increased retention and low resistance area product (RA). A MgO layer is deposited to contact a magnetic free layer of the memory element. The MgO layer is deposited in a sputter deposition chamber using a DC power and a Mg target to deposit Mg. The deposition of Mg is periodically stopped and oxygen introduced into the deposition chamber. This process is repeated a desired number of times, resulting in a multi-layer structure. The resulting MgO layer provides excellent interfacial perpendicular magnetic anisotropy to the magnetic free layer while also having a low RA.

Abstract: A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

Abstract: A magnet mounting apparatus including a cage, a magnet carriage and first actuator for use in testing Magnetic Tunnel Junction (MTJ) devices. The cage can be configured for mounting to an Automated Test Equipment (ATE). The magnet carriage can be configured for coupling to a wafer test magnet. The first actuator can be coupled between the cage and the magnet carriage. The first actuator can be configured to move the magnet carriage between a first position and a second position along a z-axis. The first position can be configured for locating the wafer test magnet within a predetermined proximity to a Device Under Test (DUT) wafer, and the second position can be configured for replacing a probe card.

Abstract: A method for manufacturing a magnetic memory array provides back end of line annealing for associated processing circuitry without causing thermal damage to magnetic memory elements of the magnetic memory array. An array of magnetic memory element pillars is formed on a wafer, and the magnetic memory elements are surrounded by a dielectric isolation material. After the pillars have been formed and surrounded by the dielectric isolation material an annealing process is performed to both anneal the memory element pillars to form a desired grain structure in the memory element pillars and also to perform back end of line thermal processing for circuitry associated with the memory element array.

Abstract: A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

Abstract: A magnetic field transducer mounting apparatus can include a first mount configured to fixedly couple to a side surface of a wafer test fixture magnet, and a second and third mount configured to adjustably position a magnetic field transducer in a predetermined location proximate a face of the wafer test fixture magnet.

Abstract: A temperature sensor comprising an elongated hollow body, such as a carrier pipe, a shaped part arranged at one end of the hollow body, and a coupling element which is thermally coupled to a measuring element. The shaped part is used for thermally insulating the coupling element from the hollow body.