Patents by Inventor George A. Carson

George A. Carson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same
    Patent number: 5895976
    Abstract: A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
    Type: Grant
    Filed: June 3, 1996
    Date of Patent: April 20, 1999
    Assignee: Motorola Corporation
    Inventors: Michelle J. Morrell, Steven C. Machuga, Grace M. O'Malley, George A. Carson, Andrew Skipor, Wen Xu Zhou, Karl W. Wyatt