Abstract: One or more systems, devices, and/or methods provided herein relate to a process for in-process radio frequency (RF) signal quality analysis and amplitude adjustment of one or more RF devices. In one or more embodiments, the RF device can comprise a portion of a quantum computing system, such as of readout electronics thereof, and thus amplitude adjustment can be at a waveform generator that generates pulses to affect one or more qubits of a quantum logic circuit of the quantum computing system. Generally, an electronic device can comprise an RF tap connected to an RF signal component of a first RF signal chain, and an analysis component connected to the RF tap, the analysis component configured to convert an RF signal from the RF signal component and to compare a conversion result thereof to an expected power output that is based on historical data for a second RF signal chain.

Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

Abstract: An assembly for testing integrated packages comprising, a test circuit board for simultaneously testing a plurality of integrated circuit packages with each package having a plurality of rows of leads extending in parallel array from the body of the package, the board having a plurality of sockets each shaped with a top, sidewalls and a bottom with the top having means forming a plurality of rows of depending recesses spaced to receive, one each, the leads, and also having a plurality of auxiliary recesses, each positioned within the sidewalls and each shaped to receive a discrete component and each associated with one of the depending lead recesses, and means for electrically connecting discrete components within the auxiliary recesses and integrated circuit package leads in the associated depending lead recesses to each other and through the sockets to the circuit board, each discrete component being electrically connected to no more than one of the circuit package leads.

Abstract: A method and apparatus for reducing itching of shaven, normally hirsute body portions during the period of hair regrowth. A lamina of flexible, smooth, non-woven material such as plastic is secured to the inner surface of the user's undergarment so that hair ends may move freely with respect to the surface rather than being trapped thereby.