Abstract: This disclosure provides a heat conduction structure and a heat dissipation device. The heat dissipation device includes the heat conduction structure and a heat conductor. The heat-absorbing side of the heat conducting base is recessed with an accommodating slot. The heat diffusion plate is movably disposed in the accommodating slot and includes an inner conducting surface, an outer conducting surface, and an anti-vibration surface. The anti-vibration surface is connected to the inner conducting surface and the outer conducting surface, and a lateral gap is reserved between the anti-vibration surface and an inner wall surface of the accommodating slot. The thermal interface material is filled in the lateral gap to have the anti-vibration effect and avoid damage caused by an external vibration for maintaining the normal operation and reliability of the system.

Abstract: A heat dissipation module with a shock resisting effect is provided. The heat dissipation module includes a heat absorbing unit, a heat dissipating unit and at least one flexible heat conducting bundle. The heat absorbing unit has a first installing surface. The heat dissipating unit is disposed corresponding to the heat absorbing unit and has a second installing surface facing the first installing surface. The flexible heat conducting bundle is connected between the first installing surface and the second installing surface, and used for transferring heat of the heat absorbing unit to the heat dissipating unit to dissipate the heat. Accordingly, the heat dissipation module is provided with a flexible stretching function and a shock resisting effect.

Abstract: A structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

Abstract: A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.

Abstract: A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.

Abstract: A vapor chamber structure includes an extruded aluminum case having a bottom plate and plural first separating units, an extruded aluminum cover combined with the extruded aluminum case correspondingly and having a top plate and plural second separating units, and a working fluid filled in an interior formed by the extruded aluminum case and the extruded aluminum cover. Each first separating unit includes plural first fins. A first groove is disposed between adjacent first fins. Each second separating unit includes plural second fins. A second groove is disposed between adjacent second fins. Each second separating unit is disposed between adjacent first separating units. The first grooves are individually interlaced with the adjacent second grooves. Thus, the heat exchange between the vaporized working fluid and the gas in adjacent grooves can be performed, which improves the efficiency of heat transfer.

Abstract: An apparatus is a heat conducting connection between a heat pipe and a structure such as an integrated circuit heat sink. The heat sink contains a groove with extension tabs protruding above edges of the groove so that the tabs can be bent over to hold the heat pipe in the groove which is dimensioned to give a clearance space around the heat pipe. When the tabs are bent down far enough to deform the heat pipe or a heat conductive hardening material is used to fill the clearance space, the heat pipe is fixed in place. If the tabs are bent down to barely contact the heat pipe and a heat conductive non-hardening material is used to fill the clearance space, the heat pipe can still be rotated within the groove.

Abstract: The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.

Abstract: The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.

Abstract: The invention is an apparatus for attaching a heat pipe to an integrated circuit or other surface. The heat pipe is held against the flat surface by a heat conducting clamp constructed as a "U" cross section with flanges on the ends of the "U" section, and both the heat pipe and the clamp are held onto the integrated circuit or other surface with heat conductive tape which has adhesive on both its faces. The heat pipe itself can be deformed so that its contact surface also is flat and yields better heat transfer with the integrated circuit.

Abstract: The disclosure is for a heat pipe in the form of a simple foil envelope and a method of constructing such a heat pipe. Two plastic coated metal foil sheets are sealed together on all four edges to enclose a semi-rigid channeled sheet of plastic foam, and the envelope is evacuated and loaded with a suitable quantity of liquid to act as a heat pipe. Despite the use of the essentially poor thermally conductive materials such as the plastic coating on the surface of the casing and the foam plastic for the wick, the apparatus operates well as a heat spreader for an integrated circuit chip placed in contact with the envelope surface. The heat is transferred across the thin plastic coating with only a small temperature differential, and the foam plastic wick with channels efficiently transports condensed liquid back to the heat input location for evaporation.

Abstract: The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the pad is attached to a simple cylindrical heat pipe. The pad includes extensions from its sides to which a holding fixture applies force so that the pad is held tightly against the chip. The holding fixture is held on the mounting board by screws while the top of the pad which is attached to the heat pipe protrudes through a hole in the holding fixture. A finned heat exchanger is attached to an end of the heat pipe remote from the conductive pad.

Abstract: A heat pipe cooling plate in which one or more heat pipes sandwiched between cover plates is an expandable heat pipe made with thin flexible walls forming the heat pipe casing. One advantage of such an expandable heat pipe within the cooling plate structure is that the heat pipe need not be bonded to the outer casing. Instead, the heat pipe balloons out when the vapor pressure increases upon heating, and the flexible heat pipe casing moves into intimate contact with the boundary surfaces of the cooling plate.

Abstract: A flat cooling plate which is assembled with individual heat pipes which are annealed, flattened tubes with sintered wicks formed within them. The completely constructed and pre-tested heat pipes are set into slots in a spacer plate which is sandwiched between two unslotted flat sheets. For assembly, bonding material is placed between the slotted plate and unslotted sheets, and the assembly is heated to the bonding material working temperature while compressed in a press in order to prevent damage from excessive internal heat pipe pressure.