Patents by Inventor George A. Reynolds, Jr.

George A. Reynolds, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RFID near field microstrip antenna
    Patent number: 7791540
    Abstract: A near field antenna is disclosed which is configured to read an RFID label such that a localized electric E field emitted by the antenna at an operating wavelength resides substantially within a zone defined by the near field. The localized E field directs a current distribution along an effective length of the antenna corresponding to a half-wave to a full-wave structure.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: September 7, 2010
    Assignee: Sensormatic Electronics, LLC
    Inventors: Gary Mark Shafer, Karen Bellum Bomber, George A. Reynolds, Jr., John Ford, Ming-Ren Lian, Edward Di Carlo, Richard L. Copeland, Marcus Christopher
  • Magnetic self-assembly for integrated circuit packages
    Publication number: 20100015730
    Abstract: An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
    Type: Application
    Filed: September 26, 2009
    Publication date: January 21, 2010
    Applicant: Sensormatic Electronics Corporation
    Inventors: Ming-Ren Lian, Gary Mark Shafer, George A. Reynolds, JR.
  • Magnetic self-assembly for integrated circuit packages
    Patent number: 7615836
    Abstract: An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: November 10, 2009
    Assignee: Sensormatic Electronics Corporation
    Inventors: Ming-Ren Lian, Gary Mark Shafer, George A. Reynolds, Jr.
  • RFID Near Field Microstrip Antenna
    Publication number: 20090015480
    Abstract: A near field antenna is disclosed which is configured to read an RFID label such that a localized electric E field emitted by the antenna at an operating wavelength resides substantially within a zone defined by the near field. The localized E field directs a current distribution along an effective length of the antenna corresponding to a half-wave to a full-wave structure.
    Type: Application
    Filed: November 2, 2005
    Publication date: January 15, 2009
    Applicant: Sensormatic Electronics Corporation
    Inventors: Gary Mark Shafer, Karen Bellum Bomber, George A. Reynolds, JR., John Ford, Ming-Ren Lian, Edward Di Carlo, Richard L. Copeland, Marcus Christopher