Patents by Inventor George Asmerom

George Asmerom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9406411
    Abstract: An apparatus includes a portion that moves along a guided path and a displacement gauge that outputs readings based on the portion's position on the guided path. The apparatus additionally includes an intermediate limit switch that is activated in response to the portion being moved to an intermediate position on the guided path. The apparatus also includes a processing device configured to calibrate the apparatus based on a first reading corresponding to a first position on the guided path and a second reading corresponding to a second position on the guided path. The processing device verifies the calibration based on a third reading corresponding to the intermediate position.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: August 2, 2016
    Assignee: Accuray Incorporated
    Inventors: Sohail Sayeh, George Asmerom, Sankaralingam Ramraj, Jian Gao, Gopinath Kuduvalli
  • Publication number: 20120203490
    Abstract: An apparatus includes a portion that moves along a guided path and a displacement gauge that outputs readings based on the portion's position on the guided path. The apparatus additionally includes an intermediate limit switch that is activated in response to the portion being moved to an intermediate position on the guided path. The apparatus also includes a processing device configured to calibrate the apparatus based on a first reading corresponding to a first position on the guided path and a second reading corresponding to a second position on the guided path. The processing device verifies the calibration based on a third reading corresponding to the intermediate position.
    Type: Application
    Filed: July 15, 2011
    Publication date: August 9, 2012
    Inventors: Sohail Sayeh, George Asmerom, Sankaralingam Ramraj, Jian Gao, Gopinath Kuduvalli
  • Patent number: 7852097
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: December 14, 2010
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • Publication number: 20080150565
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: March 4, 2008
    Publication date: June 26, 2008
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • Patent number: 7368929
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: May 6, 2008
    Assignee: Electroglas, Inc.
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda
  • Publication number: 20070164762
    Abstract: An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
    Type: Application
    Filed: January 18, 2006
    Publication date: July 19, 2007
    Inventors: Uday Nayak, Xiaolan Zhang, George Asmerom, Max Jedda