Abstract: An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.