Patents by Inventor George C. Phillips

George C. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4434134
    Abstract: Ceramic substrates are pinned using powdered metallurgy pins formed in situ on the substrate.
    Type: Grant
    Filed: April 10, 1981
    Date of Patent: February 28, 1984
    Assignee: International Business Machines Corporation
    Inventors: Russell E. Darrow, Joseph Funari, George S. Kotrch, George C. Phillips
  • Patent number: 3999004
    Abstract: This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.
    Type: Grant
    Filed: September 27, 1974
    Date of Patent: December 21, 1976
    Assignee: International Business Machines Corporation
    Inventors: Octavio I. Chirino, Joseph Hromek, Kailash C. Joshi, George C. Phillips, Jr.