Abstract: A method of minimizing crosstalk in an IC package including (A) routing a first signal between first pads and a first trace layer in an congested area, (B) routing the first signal between the first and second trace layers in an non-congested area, (C) routing the first signal between the second trace layer and first pins in the non-congested area, (D) routing a second signal between second pads and the first trace layer in the congested area, (E) routing the second signal between the first and the second trace layers in the congested area and (F) routing the second signal between the second trace layer and second pins in the non-congested area, wherein (i) all of the first and second pins are arranged along a line and (ii) the first pins are offset from the second pins by a gap of at least two inter-pin spaces.

Abstract: A method of minimizing crosstalk in an IC package including (A) routing a first signal between first pads and a first trace layer in an congested area, (B) routing the first signal between the first and second trace layers in an non-congested area, (C) routing the first signal between the second trace layer and first pins in the non-congested area, (D) routing a second signal between second pads and the first trace layer in the congested area, (E) routing the second signal between the first and the second trace layers in the congested area and (F) routing the second signal between the second trace layer and second pins in the non-congested area, wherein (i) all of the first and second pins are arranged along a line and (ii) the first pins are offset from the second pins by a gap of at least two inter-pin spaces.

Abstract: Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic components. Support structures including air as a dielectric can be provided in the form of printed circuit boards and electrical connectors. A printed circuit board wherein said dielectric material comprises a low loss material. The support medium can comprise a low loss material such as air, FR-4, Teflon material, and plastic.

Abstract: Electronic component supporting mediums includes dielectric support material having voids adapted to include the use of air as a dielectric, which is commonly used in printed circuit boards and electrical connectors. The support medium provides physical support to conductive connections and a mechanical structure to enable electrical connections between electronic components. Support structures including air as a dielectric can be provided in the form of printed circuit boards and electrical connectors. The printed circuit board of claim 16 wherein said dielectric material comprises a low loss material. The support medium can comprise a low loss material such as air, FR-4, Teflon material, and plastic.