Abstract: A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.

Abstract: A method for removing flux residue from an electronic component using a solution having tetrahydrofurfuryl alcohol (THFA) and an activator. As activators, compounds of the formula ##STR1## are used, wherein R.sub.1, R.sub.2 and R.sub.3 are independently hydrogen, C.sub.1 -C.sub.7 alkyl, C.sub.5 -C.sub.6 cycloalkyl, furanyl which can be substituted by C.sub.1 -C.sub.7 alkyl, tetrahydrofuranyl which can be substituted by C.sub.1 -C.sub.7 alkyl, pyrrolyl, pyrrolidinyl, benzyl which can be substituted by C.sub.1 -C.sub.7 alkyl, phenyl which can be substituted by C.sub.1 -C.sub.7 alkyl, C.sub.1 -C.sub.7 alkenyl, C.sub.1 -C.sub.7 alkenyl, furfuryl which can be substituted by C.sub.1 -C.sub.7 alkyl, or tetrahydrofurfuryl which can be substituted by C.sub.1 -C.sub.7 alkyl, wherein R.sub.1, R.sub.2 and R.sub.3 can be hydroxy groups, where R.sub.1, R.sub.2 and R.sub.3 are not simultaneously hydrogen, R.sub.4 is hydrogen, C.sub.1 -C.sub.6 alkyl, C.sub.5 -C.sub.6 cycloalkyl, furanyl which can be substituted by C.sub.

Abstract: The present invention offers an alternative to the chlorofluorocarbons which have been used in the cleaning industry. In particular, the present invention uses a solution having tetrahydrofurfuryl alcohol (THFA) and an activator.

Abstract: This invention comprehends an improved method for uniformly loosening and removing the thin layer of mold flash which deposits on the surface of the metal lead frames during encapsulation of the silicon integrated circuit chips bonded to that metal lead frame surface. The disclosed method does not adversely effect the underlying metal material or the encapsulating plastic material enveloping the silicon integrated circuit chip. The disclosed method is electrolytic and employs (1) the chemical dissolving action of the stripping solution and (2) the percolating effect of the hydrogen gas generated during electrolysis of the water, to loosen the unwanted organic mold flash from the metal lead frame surface.