Patents by Inventor George Carl Everett

George Carl Everett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POWER CONDITIONING MODULE
    Publication number: 20050094374
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Application
    Filed: June 30, 2004
    Publication date: May 5, 2005
    Inventors: Thomas Kenny, Kenneth Goodson, Juan Santiago, George Carl Everett
  • Apparatus for conditioning power and managing thermal energy in an electronic device
    Publication number: 20040252535
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Application
    Filed: June 30, 2004
    Publication date: December 16, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas William Kenny, Kenneth E. Goodson, Juan G. Santiago, George Carl Everett
  • Power conditioning module
    Publication number: 20040240245
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Application
    Filed: June 30, 2004
    Publication date: December 2, 2004
    Applicant: Cooligy, Inc.
    Inventors: Thomas William Kenny, Kenneth E. Goodson, Juan G. Santiago, George Carl Everett
  • Apparatus for conditioning power and managing thermal energy in an electronic device
    Publication number: 20030173942
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Application
    Filed: March 7, 2003
    Publication date: September 18, 2003
    Applicant: Cooligy, Inc.
    Inventors: Thomas William Kenny, Kenneth E. Goodson, Juan G. Santiago, George Carl Everett
  • SYSTEM INCLUDING POWER CONDITIONING MODULES
    Publication number: 20030147225
    Abstract: In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device.
    Type: Application
    Filed: March 27, 2002
    Publication date: August 7, 2003
    Inventors: Thomas William Kenny, Kenneth E. Goodson, Juan G. Santiago, John J. Kim, Robert C. Chaplinsky, George Carl Everett